XCKU11P-2FFVD900I

The XCKU11P-2FFVD900I is an industrial-grade Kintex UltraScale+ FPGA IC from AMD, delivered in a 900-FCBGA (31×31) surface-mount package. It integrates a large programmable logic fabric and significant on-chip memory to address complex, high-density digital designs.

With approximately 653,100 logic elements, roughly 54 Mbits of embedded memory, 408 I/O and an operating range of −40°C to 100°C, this device is intended for industrial applications that require high logic capacity, substantial embedded RAM and robust temperature performance. The device operates from a supply range of 825 mV to 876 mV and is RoHS compliant.

Key Features

• Core Logic Approximately 653,100 logic elements providing large programmable capacity for complex logic and custom processing functions.
• Logic Blocks 37,320 CLB-style resources for structured implementation of logic and state machines.
• Embedded Memory Approximately 54 Mbits of on-chip RAM to support buffering, frame storage, and data-path acceleration without external memory.
• I/O Density 408 I/O pins to support multiple interfaces and high-pin-count connectivity requirements.
• Power Narrow core supply range of 825 mV to 876 mV for the device core.
• Package & Mounting 900-FCBGA (31×31) / 900-BBGA package in a surface-mount form factor for compact board-level integration.
• Industrial Temperature & Grade Industrial-grade qualification with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control & Automation High logic capacity and embedded memory support complex control algorithms, sequencing and data buffering in industrial systems.
• Embedded Processing Programmable fabric and on-chip RAM enable custom accelerators and glue-logic for embedded processing tasks.
• High-density I/O Systems 408 general-purpose I/Os suit applications that require multiple parallel interfaces or a large number of peripheral connections.

Unique Advantages

• High Logic Capacity: Approximately 653,100 logic elements allow implementation of large custom logic designs without immediate need for external logic expansion.
• Substantial On-chip Memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Robust Industrial Operation: Industrial-grade rating and −40°C to 100°C operating range support deployment in temperature-challenging environments.
• High I/O Count: 408 I/Os provide flexibility for interfacing to multiple buses, peripherals and sensors.
• Compact FCBGA Package: 900-FCBGA (31×31) surface-mount package enables high-density board integration while maintaining a large internal resource set.
• Regulatory Compliance: RoHS compliance simplifies environmental qualification for many product lines.

Why Choose XCKU11P-2FFVD900I?

The XCKU11P-2FFVD900I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive programmable logic, significant embedded memory and a high I/O count in a compact 900-FCBGA package. These attributes make it suitable for engineers building complex digital systems that must operate reliably across a wide temperature range.

For designs that need scalable logic resources, on-chip RAM for data-paths, and robust industrial operation, this Kintex UltraScale+ device provides a clear, specification-driven foundation for system implementation.

Request a quote or submit an inquiry for the XCKU11P-2FFVD900I to obtain pricing and availability information from sales.