XCKU11P-3FFVA1156E

The XCKU11P-3FFVA1156E is an AMD Kintex® UltraScale+™ field programmable gate array (FPGA) in a 1156-ball FCBGA package. It provides substantial on-chip logic, embedded memory, and I/O resources for designs that require large programmable capacity within a surface-mount, extended-grade device.

With 653,100 logic elements, approximately 54 Mbits of embedded memory and 464 I/O pins, this device addresses applications that need significant logic density, on-chip buffering and extensive external interfacing while operating across a defined supply and temperature range.

Key Features

• Logic Capacity — 653,100 logic elements for complex programmable logic and large-scale digital designs.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM to support buffering, lookup tables and data storage close to logic.
• I/O Resources — 464 user I/O pins to support multiple high-density interfaces and external peripherals.
• Power Supply — Core voltage supply range of 0.873 V to 0.927 V to match system power-rail requirements.
• Package — 1156-ball FCBGA (1156-BBGA) supplier package, 35 × 35 mm, suitable for surface-mount PCB assembly.
• Mounting & Grade — Surface mount device with Extended grade classification and operating temperature range of 0 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital logic — Systems requiring hundreds of thousands of logic elements for complex state machines, datapaths or algorithm implementation.
• On-chip memory buffering — Designs that benefit from approximately 54 Mbits of embedded memory for packet buffering, FIFOs or local data storage.
• I/O-intensive interfaces — Platforms that need extensive external connectivity supported by 464 I/O pins.

Unique Advantages

• Large programmable fabric: 653,100 logic elements deliver the capacity to implement complex, multi-function designs within a single device, reducing system component count.
• Substantial embedded memory: Approximately 54 Mbits of on-chip RAM enables closer placement of data storage to logic, improving design compactness and reducing external memory dependency.
• Extensive I/O complement: 464 I/O pins provide flexibility for multiple parallel interfaces and diverse peripheral connections.
• Compact, surface-mount FCBGA package: The 1156-ball (35 × 35 mm) package balances high integration with PCB assembly compatibility.
• Extended operating range: Extended-grade classification and a 0 °C to 100 °C operating range support deployed systems with elevated thermal expectations.
• Controlled core supply window: Defined 0.873–0.927 V supply range simplifies power-rail planning for the FPGA core.

Why Choose XCKU11P-3FFVA1156E?

The XCKU11P-3FFVA1156E positions itself as a high-capacity Kintex UltraScale+ FPGA option for designers who need a balance of logic density, embedded memory and numerous I/O in a single surface-mount package. Its combination of 653,100 logic elements, approximately 54 Mbits of on-chip RAM and 464 I/Os offers a compact solution for complex programmable systems.

This extended-grade device is suited to teams building designs that require substantial on-chip resources and defined operating conditions. Its package and electrical characteristics support compact, board-level integration while providing a clear specification set for power, thermal planning and I/O budgeting.

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