XCKU11P-3FFVE1517E

The XCKU11P-3FFVE1517E is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity and on-chip memory in a 1517-ball FCBGA package, providing a compact, surface-mount solution for complex digital designs.

Key characteristics include approximately 653,100 logic elements, roughly 54 Mbits of embedded memory, 512 I/O, an extended-grade temperature range, and a specified supply voltage window, enabling deterministic hardware resources for demanding FPGA-based systems.

Key Features

• Logic Capacity  Approximately 653,100 logic elements to implement large, parallelizable digital designs.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM for buffering, FIFO, and storage of intermediate data within the FPGA fabric.
• I/O Count  512 user I/O pins to support dense interfacing with external peripherals and subsystems.
• Package and Mounting  1517-ball FCBGA (1517-BBGA) package, supplier device package 1517-FCBGA (40×40), optimized for surface-mount PCB assembly.
• Power Supply Range  Specified supply voltage range of 873 mV to 927 mV to meet the device’s operating requirements.
• Operating Temperature  Extended-grade temperature range from 0 °C to 100 °C for use in environments within that window.
• Design Scale  Contains 37,320 CLBs equivalent within the device fabric to structure logic and routing for complex designs.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

• High integration density: The large logic element count and substantial embedded memory reduce external component needs and simplify system partitioning.
• Flexible I/O capacity: 512 I/O pins accommodate a wide range of peripheral connections without immediate need for extra I/O expanders.
• Compact FCBGA package: The 1517-ball FCBGA (40×40) delivers high pin count in a space-efficient form factor for dense board layouts.
• predictable thermal window: Extended-grade operation from 0 °C to 100 °C allows designers to plan thermal management within a defined range.
• Defined supply requirements: A clear voltage supply range (873 mV–927 mV) supports precise power-supply planning and component selection.
• Standards-compliant manufacturing: RoHS compliance facilitates integration into lead‑free assembly processes.

Why Choose XCKU11P-3FFVE1517E?

The XCKU11P-3FFVE1517E positions itself as a high-capacity Kintex® UltraScale+™ FPGA option that combines a large logic fabric, substantial on-chip RAM, and abundant I/O in a 1517-ball FCBGA package. Its extended-grade temperature range, defined supply voltage window, and RoHS compliance make it a practical choice for designers who require deterministic FPGA resources and clear implementation parameters.

This device is well suited to development teams and procurement groups seeking a scalable, high-density FPGA solution from AMD’s Kintex UltraScale+ family, offering predictable hardware resources and package-level integration for complex digital systems.

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