XCKU11P-2FFVA1156I

The XCKU11P-2FFVA1156I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC provided in a 1156-ball FCBGA package. It combines high logic capacity and significant on-chip memory while supporting a wide I/O complement for complex system designs.

With 653,100 logic elements and approximately 54 Mbits of embedded memory, this device addresses designs that require substantial programmable logic and embedded RAM within an industrial-grade operating temperature range.

Key Features

• Core Logic  653,100 logic elements organized across 37,320 logic blocks, delivering programmable fabric density for complex logic implementations.
• Embedded Memory  Approximately 54 Mbits of total on-chip RAM (53,964,800 bits) to support buffering, FIFOs, and embedded data storage without external memory dependence.
• I/O Capacity  464 I/O pins to support extensive peripheral and high-pin-count interface requirements in multi-channel systems.
• Power Supply Range  Core voltage support from 825 mV to 876 mV, enabling designs that target the specified core supply window.
• Package & Mounting  1156-FCBGA (35 × 35 mm) package in a 1156-BBGA format suitable for surface-mount assembly.
• Temperature & Grade  Industrial grade operation across −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS-compliant material status to support environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Implement large-scale custom logic and datapath engines using the device’s 653,100 logic elements and extensive embedded RAM.
• Multi-channel I/O systems  Leverage 464 I/Os for designs requiring numerous parallel interfaces or multiple high-speed lanes.
• Embedded buffering and packet handling  Use approximately 54 Mbits of on-chip RAM for buffering, packet queues, and temporary data storage within the FPGA fabric.
• Industrial equipment  Deploy in temperature-demanding applications that require industrial-grade operation from −40 °C to 100 °C.

Unique Advantages

• Large logic capacity: 653,100 logic elements enable complex custom logic, algorithm acceleration, and wide datapath implementations without frequent part changes.
• Substantial embedded memory: Approximately 54 Mbits of on-chip RAM reduces reliance on external memory, simplifying board design and lowering BOM complexity.
• Generous I/O availability: 464 I/Os support dense connectivity, making it easier to interface with multiple peripherals, sensors, or transceivers.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to meet environmental requirements for industrial deployments.
• Compact FCBGA package: 1156-FCBGA (35 × 35 mm) provides a high-pin-count solution in a compact surface-mount form factor for space-constrained PCBs.
• RoHS compliance: Supports environmentally conscious manufacturing and regulatory requirements.

Why Choose XCKU11P-2FFVA1156I?

The XCKU11P-2FFVA1156I balances high programmable logic density, substantial on-chip RAM, and broad I/O capability in a compact 1156-FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust, long-running designs where integration density and embedded memory are priorities.

This device is appropriate for engineering teams developing complex FPGA-based systems that require scalable logic resources, significant embedded buffering, and high I/O counts while maintaining compact board-level integration.

Request a quote or submit an inquiry to evaluate XCKU11P-2FFVA1156I for your next design and obtain pricing, lead time, and ordering information.