XCKU11P-1FFVE1517E

The XCKU11P-1FFVE1517E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high on-chip resource set including logic, embedded memory, and I/O in a 1517-ball FCBGA package for surface-mount integration. This device is specified with an extended grade operating range and low-voltage core supply, suitable for designs that require significant programmable logic capacity, embedded memory, and a large I/O complement.

Key Features

• Core Logic — 653,100 logic elements and 37,320 CLBs provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory — Approximately 54 Mbits of on-chip RAM to support large buffers, FIFOs, and data storage close to logic.
• I/O Count — 512 user I/O pins for wide-ranging interface requirements and parallel connectivity.
• Power Supply — Core voltage supply range of 825 mV to 876 mV for the device core.
• Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Regulatory — RoHS compliant.

Unique Advantages

• High logic capacity: 653,100 logic elements enable implementation of large-scale, highly parallel architectures without external programmable logic.
• Substantial embedded memory: Approximately 54 Mbits of on-chip RAM reduces dependence on external memory for intermediate data storage.
• Extensive I/O resources: 512 I/O pins provide flexibility for multiple interfaces and broad system connectivity.
• Compact FCBGA package: The 1517-FCBGA (40×40) package supports dense integration on modern PCBs while maintaining a surface-mount footprint.
• Low-voltage core operation: Core supply between 825 mV and 876 mV aligns with low-voltage system designs.
• Extended operating range: Rated for 0 °C to 100 °C operation and provided in an extended grade for broader environmental use cases.

Why Choose XCKU11P-1FFVE1517E?

The XCKU11P-1FFVE1517E balances a large programmable logic fabric with significant embedded memory and a high I/O count in a compact 1517-FCBGA package. Its combination of 653,100 logic elements, approximately 54 Mbits of on-chip RAM, and 512 I/Os makes it well suited for complex FPGA-based systems that demand integrated resources and board-level density.

Designed and supplied by AMD, this Kintex® UltraScale+™ device provides a clear upgrade path for projects that need substantial programmable capacity while maintaining a compact footprint and extended-grade temperature operation. It is a practical choice for engineering teams seeking scalable, high-resource FPGAs with surface-mount packaging.

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