XCKU11P-1FFVD900E

The XCKU11P-1FFVD900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 900-FCBGA surface-mount package. It combines a high count of configurable logic resources and embedded memory with a substantial I/O complement, making it suitable for dense programmable logic implementations.

Key on-chip resources include 653,100 logic elements and approximately 54 Mbits of embedded memory. The device operates from a core supply range of 825 mV to 876 mV and is specified for operation from 0 °C to 100 °C in an extended grade.

Key Features

• Logic Resources  Contains 37,320 CLBs (configurable logic blocks) and 653,100 logic elements for implementing complex digital designs.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM to support buffering, lookup tables, and algorithm state storage.
• I/O Capacity  Provides 408 I/O pins to support multi-channel interfaces and dense connectivity requirements.
• Power Supply Range  Core voltage supply operates between 825 mV and 876 mV, enabling defined power domain planning.
• Package & Mounting  900-FCBGA (31 × 31 mm) package in a 900-BBGA footprint, designed for surface-mount PCB assembly.
• Temperature & Grade  Extended-grade device specified for operation from 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic designs  Implement complex programmable logic using 653,100 logic elements and 37,320 CLBs for advanced digital functions.
• Memory-intensive processing  Use the approximately 54 Mbits of embedded memory for buffering, tables, and on-chip data storage.
• I/O-rich systems  Leverage 408 I/O pins to connect multiple high-speed interfaces or many peripheral channels in a compact package.
• Compact board-level integration  900-FCBGA surface-mount packaging supports dense board layouts where high integration is required.

Unique Advantages

• High logic density: 653,100 logic elements and 37,320 CLBs enable implementation of large, complex designs on a single device.
• Substantial on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependency on external memory for intermediate storage and buffering.
• Ample I/O: 408 available I/Os accommodate multi-channel connectivity without immediate need for external multiplexing.
• Compact FCBGA package: 900-FCBGA (31×31) balances high pin count with a PCB-friendly surface-mount form factor.
• Defined operating envelope: Extended-grade specification with 0 °C to 100 °C operating temperature and a clear core voltage range simplifies system-level planning.

Why Choose XCKU11P-1FFVD900E?

The XCKU11P-1FFVD900E positions itself as a high-density Kintex UltraScale+ FPGA option that brings together large logic capacity, significant embedded memory, and substantial I/O in a single 900-FCBGA surface-mount package. Its extended-grade temperature rating and defined core voltage range make it suitable for designs that require reliable operation within the specified environmental and electrical limits.

This device is appropriate for engineering teams and procurement focused on consolidating complex digital functions onto a single programmable device, where on-chip resources and I/O count directly address integration and board-level density requirements.

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