XCKU115-3FLVB2104E

The XCKU115-3FLVB2104E is an AMD Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC supplied in a 2104-FCBGA package. It delivers very high logic capacity and on-chip memory in a surface-mount FCBGA footprint for complex programmable logic implementations.

This device targets designs that require large numbers of logic elements, significant embedded RAM, and substantial I/O connectivity while operating within an extended-grade temperature range.

Key Features

• Logic Capacity  1,451,100 logic elements for large-scale programmable logic and complex digital functions.
• Embedded Memory  Approximately 77.7 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Density  702 user I/O pins to accommodate multiple high-pin-count interfaces and board-level connectivity.
• Power Supply  Core voltage range of 970 mV to 1.03 V for core power planning and supply design.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm), surface-mount, enabling compact board integration.
• Operating Range & Grade  Extended grade with an operating temperature range from 0 °C to 100 °C.

Unique Advantages

• High logic density: The 1.45M+ logic-element capacity enables consolidation of large, complex digital subsystems into a single device.
• Substantial on-chip memory: Approximately 77.7 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O resources: 702 I/O pins provide flexible connectivity for multi-interface systems and high-pin-count designs.
• Compact FCBGA footprint: The 2104-FCBGA (47.5 × 47.5 mm) package offers a high-pin-count solution in a mountable surface package.
• Defined power envelope: A specified core voltage range (970 mV–1.03 V) helps with precise power-supply and thermal planning.
• Extended operating grade: Rated for 0 °C to 100 °C ambient operation to meet a range of application environments.

Why Choose XCKU115-3FLVB2104E?

The XCKU115-3FLVB2104E combines very high logic element count, significant embedded RAM, and a large I/O complement in a 2104-FCBGA surface-mount package, positioning it for demanding programmable logic applications that require consolidation of complex functions. Its specified core voltage range and extended operating temperature grade support predictable system-level power and thermal design.

This device is suited for teams and projects that need scalable FPGA capacity, substantial on-chip memory, and broad I/O without moving to multiple discrete components. The combination of these attributes offers long-term design value through integration and clear electrical and thermal parameters.

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