XCKU115-2FLVF1924I

The XCKU115-2FLVF1924I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. This device delivers a very large programmable fabric with 1,451,100 logic elements, approximately 77.7 Mbits of embedded memory, and 728 user I/O pins in a 1924‑FCBGA package.

Specified for industrial use with a surface‑mount 1924‑FCBGA (45×45) package and an operating range of -40 °C to 100 °C, the device is intended for designs that require high integration density, substantial on‑chip RAM, and a large number of I/O connections. Supply voltage is specified between 922 mV and 979 mV.

Key Features

• Logic Capacity — 1,451,100 logic elements to implement large-scale programmable logic, custom datapaths, and parallel processing functions.
• Embedded Memory — Approximately 77.7 Mbits of on‑chip RAM for buffering, look‑up tables, and memory‑intensive algorithms without external memory dependency.
• I/O Density — 728 user I/O pins to support numerous interfaces, parallel buses, and high‑pin‑count system connections.
• Package and Mounting — 1924‑BBGA / 1924‑FCBGA package (supplier package: 1924‑FCBGA 45×45) in a surface‑mount form factor for compact board layout and high pin‑count routing.
• Power — Specified supply voltage range from 922 mV to 979 mV to match system power rails and regulator designs.
• Operating Range — Industrial temperature rating from -40 °C to 100 °C for deployment in thermally demanding environments.
• Manufacturer — Produced by AMD and provided in a form factor suited to high‑density FPGA deployments.
• Standards — RoHS compliant, supporting environmental regulations for lead‑free assembly.

Typical Applications

• High‑density digital processing — Use the 1,451,100 logic elements and substantial embedded memory to implement complex algorithms, wide parallel datapaths, and custom hardware accelerators.
• Multi‑interface aggregation — The 728 I/O pins accommodate numerous serial and parallel interfaces, sensor arrays, or multiport connectivity on a single device.
• On‑board buffering and memory‑intensive logic — Approximately 77.7 Mbits of embedded RAM supports large FIFOs, packet buffering, and temporary data storage without immediate need for external memory.

Unique Advantages

• Extensive programmable fabric: 1,451,100 logic elements allow designers to consolidate multiple functions into a single device, reducing BOM complexity.
• Significant on‑chip memory: Approximately 77.7 Mbits of embedded RAM enables large local storage for improved data throughput and lower external memory dependence.
• High I/O count: 728 user I/Os provide flexibility to interface directly with many peripherals and system buses, simplifying board-level architecture.
• Industrial temperature range: Rated from -40 °C to 100 °C to support deployments where extended ambient temperatures are expected.
• Compact, high‑pin package: 1924‑FCBGA (45×45) surface‑mount package supports dense PCB routing while maintaining robust mechanical mounting.
• RoHS compliant: Conforms to environmental lead‑free requirements for modern electronic assembly processes.

Why Choose XCKU115-2FLVF1924I?

The XCKU115-2FLVF1924I positions itself as a high‑capacity, highly integrated FPGA option for designs that demand large programmable logic resources, abundant embedded memory, and extensive I/O connectivity. Its industrial temperature rating and surface‑mount 1924‑FCBGA package make it suitable for compact, robust system designs requiring long‑term stability.

Designed and manufactured by AMD, this Kintex® UltraScale™ device provides a combination of logic density, on‑chip RAM, and I/O scalability that supports complex, evolving projects—enabling consolidation of functions and potential reductions in system BOM and board complexity.

Request a quote or submit an inquiry for pricing and availability of the XCKU115-2FLVF1924I to evaluate its fit for your next design.