XCKU095-2FFVB2104I

The XCKU095-2FFVB2104I is an AMD Kintex® UltraScale™ Field Programmable Gate Array (FPGA) supplied in a 2104-FCBGA package. It delivers large programmable logic capacity, substantial on-chip RAM, and a high I/O count for systems that require dense, reconfigurable logic in an industrial-grade component.

Key attributes include approximately 1,176,000 logic elements, roughly 60.5 Mbits of embedded memory, and 702 I/O pins, making the device suitable for complex digital processing and control tasks across industrial and high-density embedded applications.

Key Features

• Programmable Logic Capacity  Approximately 1,176,000 logic elements provide extensive resources for implementing complex custom logic, datapath, and control structures.
• Configurable Logic Blocks (CLBs)  67,200 CLBs enable fine-grained logic partitioning and scalable designs.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM support large buffers, FIFOs, and memory-intensive functions without external memory.
• High I/O Count  702 general-purpose I/O pins enable connectivity to multiple peripherals, interfaces, and high-density board-level routing.
• Low-Voltage Core Supply  Core voltage range of 922 mV to 979 mV for compatibility with modern low-voltage power architectures.
• Industrial Temperature and Grade  Rated for operation from −40 °C to 100 °C and specified as Industrial grade for deployment in demanding environments.
• Package & Mounting  2104-FCBGA package (47.5×47.5 mm) with surface-mount mounting type for high-density PCB assembly.
• Regulatory Compliance  RoHS compliant to meet common environmental requirements.

Typical Applications

• Industrial Control  Use the FPGA’s industrial temperature rating, high I/O count, and large logic capacity for motion control, PLC extensions, and machine automation.
• High‑Performance Embedded Systems  Implement compute-dense algorithms, custom accelerators, and interface bridging using the device’s abundant logic and on-chip memory.
• Network and Communication Equipment  Leverage the high I/O density and large programmable fabric for packet processing, protocol offload, and high-throughput I/O handling.

Unique Advantages

• Large Programmable Capacity: Approximately 1,176,000 logic elements enable complex system-on-chip style implementations without numerous discrete components.
• Substantial On-Chip Memory: About 60.5 Mbits of embedded RAM reduce dependence on external memory for buffering and state storage.
• High I/O Integration: 702 I/Os simplify board-level integration of multiple interfaces and peripherals.
• Industrial Operating Range: Rated from −40 °C to 100 °C for reliable operation in challenging thermal environments.
• Compact FCBGA Package: 2104-FCBGA (47.5×47.5 mm) enables high-density PCB designs with surface-mount assembly.
• Low-Voltage Core: Core supply range of 922–979 mV supports integration with modern power delivery designs.

Why Choose XCKU095-2FFVB2104I?

The XCKU095-2FFVB2104I balances very large programmable logic capacity, significant embedded memory, and a high I/O count within a compact industrial-grade FCBGA package. These characteristics position the device for complex, high-density designs where on-chip resources and robust operating range are critical.

Engineers and procurement teams seeking a scalable FPGA solution for industrial control, high-performance embedded platforms, or network equipment can rely on the device’s quantified resources and packaging to simplify system architecture and long-term deployment planning.

Request a quote or submit a request for pricing and availability to evaluate the XCKU095-2FFVB2104I for your next design.