XCKU095-2FFVB1760I

The XCKU095-2FFVB1760I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-ball FCBGA surface-mount package. It delivers very large programmable logic capacity along with substantial on-chip memory and a high I/O count for designs that require dense integration and extensive external connectivity.

Designed for industrial-grade applications, this device operates over a wide temperature range and a defined core supply window, enabling use in systems where thermal and power boundaries are important design considerations.

Key Features

• Logic Capacity  Approximately 1,176,000 logic elements to support complex, high-density programmable logic designs.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• I/O Resources  702 device I/Os for extensive external connectivity and interface flexibility.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package for a compact, board-mounted high-density solution.
• Power Supply Range  Core supply specified from 0.922 V to 0.979 V to guide power delivery and sequencing design.
• Industrial Temperature Rating  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems — Use this device where large logic element counts are required to implement complex, custom digital hardware functions.
• Memory-intensive FPGA designs — Embedded memory capacity supports buffering, lookup tables, and logic that relies on substantial on-chip RAM.
• Systems requiring extensive I/O — With 702 I/Os, the device fits designs that need numerous external interfaces or parallel connectivity.
• Industrial control and automation — Industrial grade temperature range and robust package make it suitable for sustained operation in industrial environments.

Unique Advantages

• Large programmable capacity: Approximately 1,176,000 logic elements enable integration of complex logic, reducing the need for multiple devices.
• Substantial on-chip memory: Approximately 60.5 Mbits of embedded RAM minimizes dependence on external memory components for many applications.
• High I/O count: 702 I/Os simplify board-level connectivity and support numerous peripheral interfaces directly from the FPGA.
• Industrial temperature tolerance: −40 °C to 100 °C operating range supports deployment in thermally challenging environments.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) offers a dense, surface-mount form factor for space-constrained PCBs.
• Defined supply window: Core voltage specification (0.922 V–0.979 V) helps engineers design predictable power distribution and sequencing.

Why Choose XCKU095-2FFVB1760I?

The XCKU095-2FFVB1760I is positioned for designs that demand very large logic capacity, significant embedded memory, and extensive I/O within a single FPGA package. Its industrial temperature range and RoHS compliance make it appropriate for projects where environmental robustness and regulatory compliance are priorities.

This device suits system designers and engineers who need to consolidate complex digital functions into a compact FCBGA package while maintaining predictable power and thermal design parameters. Its combination of logic resources, on-chip RAM, and I/O count provides a scalable foundation for long-term product development and integration.

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