XCKU095-1FFVC1517C

The XCKU095-1FFVC1517C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD offered in a 1517-FCBGA package. It combines a high logic capacity with substantial on-chip memory and a large I/O count, providing a platform for designs that require programmable logic density, embedded RAM, and extensive I/O integration.

Key Features

• Logic Capacity 67200 CLBs delivering 1,176,000 logic elements for implementing complex digital logic and custom architectures.
• Embedded Memory Approximately 60.5 Mbits of on-chip RAM to support data buffering, large state machines, and memory-intensive functions.
• I/O Integration 520 general-purpose I/Os to support high pin-count designs and multiple parallel interfaces.
• Power Operates within a supply voltage range of 922 mV to 979 mV, enabling designs that target this specified core-voltage window.
• Package and Mounting Supplied in a 1517-FCBGA (1517-BBGA) package (40 × 40), designed for surface-mount assembly.
• Thermal and Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Prototyping and Development — High logic density and abundant I/O make this FPGA suitable for complex prototype platforms and programmable system validation.
• Custom Logic Acceleration — Large logic element and embedded memory resources support implementation of hardware-accelerated functions and datapath processing.
• High-Density I/O Systems — The 520 I/Os enable designs that require multiple parallel interfaces or high channel counts.

Unique Advantages

• High logic density: 1,176,000 logic elements allow consolidation of large or multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 60.5 Mbits of embedded RAM reduces dependency on external memory for many buffering and state storage needs.
• Extensive I/O availability: 520 I/Os provide flexibility for interfacing to numerous peripherals and parallel data paths without additional bridging logic.
• Compact surface-mount FCBGA: The 1517-FCBGA (40×40) package supports high-density board layouts while maintaining a standardized ball-grid form factor.
• Commercial temperature range: Rated for 0 °C to 85 °C to match a wide set of general-purpose electronic applications.
• RoHS compliant: Meets environmental directives for lead-free manufacturing processes.

Why Choose XCKU095-1FFVC1517C?

The XCKU095-1FFVC1517C positions itself as a high-capacity Kintex® UltraScale™ FPGA option for designs that require a combination of extensive logic resources, significant embedded memory, and a large number of I/Os in a single surface-mount FCBGA package. Its specifications make it suitable for developers and engineers building complex programmable systems that benefit from integrated memory and high pin counts.

With commercial-grade temperature ratings, a defined supply voltage range, and RoHS compliance, this device offers a clear, specification-driven foundation for scalable designs that need dense programmable logic and robust I/O integration.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU095-1FFVC1517C and to discuss how it fits your next FPGA-based design.