XCKU095-2FFVA1156E

The XCKU095-2FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 1156-FCBGA (35×35) surface-mount package. It delivers large on-chip resources—1,176,000 logic elements and approximately 60.5 Mbits of embedded memory—combined with 520 user I/Os to support complex programmable logic designs.

This device is intended for designs that require substantial logic capacity, significant embedded RAM, and a high I/O count, with operating support across an extended temperature range and a defined low-voltage core supply range.

Key Features

• Logic Capacity  1,176,000 logic elements to implement large-scale programmable logic and complex digital functions.
• Embedded Memory  Approximately 60.5 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive functions.
• I/O Density  520 user I/Os to interface with high-pin-count peripherals and multi-channel systems.
• Power Supply  Core voltage supply range of 922 mV to 979 mV for defined low-voltage operation.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for high-density board integration; listed package case also shows 1156-BBGA, FCBGA.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital designs  Use the device where large programmable logic capacity and abundant on-chip RAM are needed to implement complex algorithms or multi-function designs.
• I/O-intensive systems  Ideal for boards requiring many external interfaces, leveraging 520 user I/Os for parallel and multi-channel connectivity.
• Memory-heavy processing  Utilize the approximately 60.5 Mbits of embedded memory for buffering, data staging, and LUT-based implementations.
• Prototyping and integration  Suitable for hardware prototyping or consolidated designs that combine multiple functions into a single FPGA footprint.

Unique Advantages

• Substantial logic resources: 1,176,000 logic elements provide headroom for large designs, reducing the need for external logic components.
• Significant on-chip memory: Approximately 60.5 Mbits of embedded RAM enables efficient local data storage and high-throughput data handling.
• High I/O count: 520 I/Os simplify system-level integration by supporting numerous interfaces without additional I/O expanders.
• Compact board integration: 1156-FCBGA surface-mount package supports dense PCB layouts while maintaining thermal and signal routing considerations typical for BGA devices.
• Defined power envelope: A specified core voltage range of 922 mV to 979 mV helps align power supply design and validation efforts.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet a range of environment requirements within that temperature window.

Why Choose XCKU095-2FFVA1156E?

The XCKU095-2FFVA1156E combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a compact 1156-FCBGA package, making it suitable for designs that consolidate multiple functions onto a single FPGA. Its defined voltage range and extended temperature grade provide clear engineering parameters for system power and thermal design.

This Kintex® UltraScale™ device is appropriate for development teams and integrators targeting complex, I/O-rich designs that benefit from on-chip resources and a surface-mount BGA footprint, offering a balance of integration and predictable electrical and thermal characteristics.

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