XCKU095-2FFVB1760E

The XCKU095-2FFVB1760E is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD supplied in a 1760-FCBGA package. It provides a combination of large logic capacity, on-chip memory, and extensive I/O for complex, programmable digital designs.

Key on-chip resources include 1,176,000 logic elements, approximately 60.5 Mbits of embedded memory, and 702 I/Os, making this device suitable for designs that require high logic density and significant local RAM. The device is an extended-grade, surface-mount FCBGA (1760, 42.5 × 42.5 mm) with a specified supply voltage range of 922 mV to 979 mV and an operating temperature range of 0 °C to 100 °C. RoHS compliance is declared.

Key Features

• Core Logic Capacity 1,176,000 logic elements and 67,200 configurable logic blocks provide a large fabric for implementing complex digital functions and custom architectures.
• Embedded Memory Approximately 60.5 Mbits of on-chip RAM for buffering, state storage, and local data processing without external memory dependence.
• High I/O Count 702 available I/O pins support wide parallel interfaces, multi-lane connectivity, and dense external device integration.
• Package & Mounting 1760-FCBGA package (42.5 × 42.5 mm) optimized for surface-mount assembly; FCBGA ball-array packaging supports compact board-level integration.
• Power Supply Range Specified supply voltage range from 922 mV to 979 mV to match system power rails and regulator specifications.
• Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for environments within that thermal window.
• Regulatory RoHS compliant for alignment with environmental requirements.

Typical Applications

• Signal processing and compute acceleration Use the large logic element count and embedded RAM to implement parallel processing pipelines and custom accelerators.
• High-density I/O bridging and protocol conversion Leverage 702 I/Os to connect multiple high-speed interfaces and perform protocol adaptation on-board.
• Prototype and system development Deploy as a platform for development of complex digital systems that require reconfigurable logic and substantial local memory.

Unique Advantages

• Substantial logic resources: 1,176,000 logic elements enable complex, large-scale logic implementations without partitioning across multiple devices.
• Generous embedded memory: Approximately 60.5 Mbits of on-chip RAM reduces dependency on external memory for many buffering and stateful functions.
• Extensive I/O capability: 702 I/Os simplify board-level integration for multi-channel and parallel interface designs.
• Compact FCBGA packaging: 1760-FCBGA (42.5 × 42.5 mm) supports high-density assemblies while maintaining a manageable board footprint.
• Defined operating window: Extended grade and an operating temperature range of 0 °C to 100 °C give clear environmental limits for system design.
• RoHS compliant: Meets environmental regulations for lead-free manufacturing requirements.

Why Choose XCKU095-2FFVB1760E?

The XCKU095-2FFVB1760E positions itself as a high-capacity Kintex® UltraScale™ FPGA option for designs that require a large programmable fabric, substantial embedded memory, and broad I/O availability in a single FCBGA package. Its extended-grade rating and defined supply and temperature ranges make it suitable for systems operating within those specifications.

This part is appropriate for engineering teams and procurement seeking a scalable, reconfigurable device for complex digital designs where on-chip logic density, local RAM, and I/O count are primary selection criteria. The combination of resources supports sustained development and long-term deployment within the stated electrical and thermal limits.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XCKU095-2FFVB1760E. Provide your quantity and delivery requirements to get a tailored response.