XCKU095-2FFVA1156I

The XCKU095-2FFVA1156I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It provides a high on-chip logic capacity and substantial embedded memory along with a large I/O count in a 1156‑ball FCBGA package.

Designed for applications that require large logic resources, significant on-chip RAM, and extensive external interfacing, this device combines industrial temperature range operation with RoHS compliance for deployment in demanding environments.

Key Features

• Logic Capacity — 1,176,000 logic elements and 67,200 CLBs (configurable logic blocks) to support complex digital designs.
• Embedded Memory — Approximately 60.5 Mbits of on-chip RAM for data buffering, frame storage, and intermediate processing.
• I/O Density — 520 user I/O pins to accommodate high-pin-count interfaces and multiple parallel connections.
• Package — 1156‑BBGA (1156‑FCBGA) package, supplied as 1156‑FCBGA (35×35), for high-density board integration.
• Power — Operates with a core voltage supply range of 922 mV to 979 mV.
• Mounting and Grade — Surface-mount device specified as Industrial grade for extended-environment deployment.
• Temperature Range — Rated for operation from −40 °C to 100 °C to support industrial temperature requirements.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Large logic and on-chip RAM capacity support complex FPGA-based signal processing and algorithm acceleration.
• Networking and communications — High I/O count enables implementation of parallel interfaces, packet processing, and protocol bridging.
• Industrial control and automation — Industrial temperature rating and robust I/O make it suitable for control systems and real-time logic in industrial environments.

Unique Advantages

• Substantial logic resources: 1,176,000 logic elements allow for integration of large, multi-function designs on a single device.
• Significant embedded memory: Approximately 60.5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O capacity: 520 I/O pins enable broad connectivity and support for multiple parallel interfaces without I/O multiplexing compromises.
• Industrial temperature operation: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, high-density package: 1156‑FCBGA (35×35) provides a high pin-count solution in a single surface-mount package for space-constrained designs.
• Regulatory compliance: RoHS compliance facilitates integration into products requiring restricted-substance conformity.

Why Choose XCKU095-2FFVA1156I?

The XCKU095-2FFVA1156I combines very large logic capacity, substantial embedded RAM, and a high I/O count in an industrial-grade FCBGA package. These attributes make it appropriate for system designs that consolidate multiple functions into a single FPGA, reduce external component count, and require reliable operation across a wide temperature range.

For engineering teams developing complex digital, communication, or industrial control systems that need scalable logic and memory resources with robust interfacing options, this Kintex® UltraScale™ device offers a balance of integration and environmental suitability backed by AMD’s FPGA product lineage.

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