XCKU095-1FFVB1760I
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 702 60518400 1176000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 207 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 702 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 67200 | Number of Logic Elements/Cells | 1176000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 60518400 |
Overview of XCKU095-1FFVB1760I – Kintex® UltraScale™ Field Programmable Gate Array (1760-FCBGA)
The XCKU095-1FFVB1760I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-BBGA (1760-FCBGA) package. It is an industrial-grade, surface-mount FPGA designed to provide large programmable logic capacity, substantial embedded memory, and a high I/O count for demanding embedded designs.
Key Features
- Logic Capacity Provides 1,176,000 logic elements to implement complex programmable logic and custom processing pipelines.
- Embedded Memory Approximately 60.5 Mbits of on-chip RAM for buffering, lookup tables and local storage.
- I/O Capability 702 general-purpose I/O pins to support extensive peripheral interfacing and board-level connectivity.
- Power Supply Range Operates with supply rail voltages between 922 mV and 979 mV, enabling predictable power-domain specification.
- Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) ball-grid package, surface-mount for compact, high-pin-count board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
- Regulatory Compliance RoHS compliant, supporting environmentally conscious manufacturing and assembly processes.
Unique Advantages
- Large Programmable Capacity: 1,176,000 logic elements enable implementation of complex algorithms and substantial parallel processing on-chip.
- Significant On-Chip Memory: Approximately 60.5 Mbits of embedded RAM reduces dependency on external memory for many buffering and state-storage tasks.
- High I/O Count: 702 I/O pins simplify integration with multiple peripherals, sensors, and high-density board designs.
- Industrial Temperature Support: −40 °C to 100 °C rating provides robustness for harsh or thermally variable operating environments.
- Compact High-Pin-Count Package: 1760-FCBGA (42.5 × 42.5 mm) enables dense routing and board-level integration while maintaining high connectivity.
- RoHS Compliance: Conforms to RoHS requirements to support compliant manufacturing and assembly workflows.
Why Choose XCKU095-1FFVB1760I?
The XCKU095-1FFVB1760I combines large programmable logic resources, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount FCBGA package. These characteristics make it well-suited for designs that require on-chip capacity, numerous interfaces, and operation across a wide temperature range.
Backed by the Kintex® UltraScale™ family from AMD, this device offers a scalable platform for teams developing complex embedded systems that demand significant logic and memory integration while maintaining compliance with RoHS and industrial temperature specifications.
Request a quote or contact sales to discuss availability, lead times and pricing for the XCKU095-1FFVB1760I.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
