XCKU085-L1FLVB1760I

The XCKU085-L1FLVB1760I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1760-FCBGA package. It provides high logic capacity and substantial on-chip memory in a surface-mount FCBGA footprint for demanding programmable-logic designs.

Designed for industrial-grade applications, this device combines approximately 1,088,325 logic elements, approximately 58.3 Mbits of embedded memory, 676 I/O, and an operating range from -40 °C to 100 °C with a nominal supply window of 880 mV to 979 mV.

Key Features

• Core Logic  Approximately 1,088,325 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 58.3 Mbits of embedded memory (58,265,600 bits) for on-chip buffering and data storage.
• I/O Density  676 I/O pins to support complex interfacing and system interconnect requirements.
• Power Supply  Operates from 880 mV to 979 mV, providing a defined supply window for core operation.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) / 1760-BBGA package; surface-mount mounting type for board-level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for restricted-substances conformance.

Typical Applications

• Industrial control and automation  Well suited to industrial systems that require wide operating temperatures and high logic density for control, monitoring, and protocol handling.
• High-density digital processing  Appropriate for designs requiring large-scale logic and on-chip memory for buffering and data manipulation.
• System prototyping and integration  Useful for FPGA-based system integration and prototyping where significant I/O count and reprogrammable logic are required.

Unique Advantages

• High logic density:  Approximately 1,088,325 logic elements enable consolidation of extensive functions onto a single device, reducing board-level complexity.
• Substantial on-chip memory:  Approximately 58.3 Mbits of embedded memory lowers the need for external memory in many designs.
• Generous I/O capacity:  676 I/O provide the connectivity needed for dense interfaces and multi-channel systems.
• Industrial temperature tolerance:  -40 °C to 100 °C operation supports deployments in harsh or wide-temperature environments.
• Compact, high-pin-count package:  1760-FCBGA (42.5 × 42.5 mm) combines a high pin count with a surface-mount form factor for compact system designs.
• RoHS compliance:  Meets RoHS requirements to support environmentally conscious manufacturing and procurement.

Why Choose XCKU085-L1FLVB1760I?

The XCKU085-L1FLVB1760I positions itself as a high-capacity Kintex® UltraScale™ FPGA option for engineers who need a balance of logic density, on-chip memory, and I/O integration in an industrial-grade device. Its specified supply range and broad operating temperature make it suitable for designs that demand stable operation across challenging environments.

This device is well suited to teams developing complex programmable-logic systems that require scalability, reduced board-level components through integration, and a compact high-pin-count package for dense system implementations.

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