XCKU085-2FLVF1924I

The XCKU085-2FLVF1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC supplied in a 1924-ball FCBGA package. It delivers a high count of logic elements, substantial on-chip memory, and a large I/O complement for designs requiring dense programmable logic and extensive I/O connectivity.

Designed for industrial environments, this device supports a wide operating temperature range and a defined supply voltage window to meet demanding deployment conditions where sustained operation and integration density are priorities.

Key Features

• Logic Capacity  Approximately 1,088,325 logic elements provide a high-density programmable fabric for complex logic implementations.
• Embedded Memory  Approximately 58.3 Mbits of on-chip RAM (58,265,600 bits) to support data buffering, state machines, and local storage requirements.
• I/O Resources  624 I/O pins allow broad external interfacing and flexible system partitioning for mixed-signal front ends, sensors, and peripherals.
• Package & Mounting  Supplied in a 1924-FCBGA (45×45) package, with surface-mount mounting for compact board-level integration.
• Power  Defined supply voltage range from 922 mV to 979 mV for core power planning and regulator selection.
• Operating Temperature  Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-variable environments.
• Compliance  RoHS-compliant manufacturing supports regulatory requirements for lead-free assembly.

Typical Applications

• High-density programmable logic  Use where large logic capacity and on-chip RAM are required to implement complex digital designs within a single FPGA.
• I/O-intensive systems  Ideal for designs that require extensive external interfacing thanks to the device's 624 I/O pins.
• Industrial embedded systems  Suitable for embedded applications that need operation across −40 °C to 100 °C temperature ranges and surface-mount packaging.

Unique Advantages

• High logic density:  Over one million logic elements enable consolidation of large designs and reduce the need for multiple devices.
• Substantial on-chip memory:  Approximately 58.3 Mbits of embedded RAM supports local buffering and state storage, simplifying external memory requirements.
• Extensive I/O count:  624 I/Os provide flexibility for parallel interfaces, control signals, and mixed-domain connectivity.
• Industrial temperature capability:  Rated for −40 °C to 100 °C operation to address temperature-challenging deployments.
• Compact FCBGA packaging:  1924-ball FCBGA (45×45) enables high integration density in a manufacturable surface-mount form factor.
• RoHS compliant:  Meets lead-free manufacturing requirements for environmentally conscious designs.

Why Choose XCKU085-2FLVF1924I?

The XCKU085-2FLVF1924I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand significant programmable logic, substantial embedded memory, and broad I/O resources within a compact FCBGA package. Its defined core supply range and extended operating temperature make it suitable for robust embedded and industrial applications.

For engineering teams building dense digital systems or I/O-rich controllers, this device delivers the integration density and environmental tolerance needed to streamline board-level design and simplify system partitioning.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU085-2FLVF1924I.