XCKU085-2FLVF1924E

The XCKU085-2FLVF1924E is a Kintex® UltraScale™ FPGA in a 1924-FCBGA (45×45) surface-mount package. It provides a large logic fabric—1,088,325 logic elements—paired with approximately 58.27 Mbits of embedded memory and 624 user I/O to address complex digital designs.

Designed for extended-grade operation, this device supports a core supply range of 922 mV to 979 mV and an ambient operating range of 0 °C to 100 °C, offering a compact, high-capacity platform for dense system integration.

Key Features

• Core Capacity  Provides 1,088,325 logic elements to implement large combinational and sequential designs within a single device.
• Embedded Memory  Approximately 58.27 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage without external memory for many functions.
• I/O Density  624 user I/O pins deliver a high degree of external connectivity for multi-channel interfaces and board-level integration.
• Package & Mounting  Supplied in a 1924-FCBGA (45×45) package, designed for surface-mount assembly to fit compact, high-density PCBs.
• Power  Core voltage supply range specified at 922 mV to 979 mV to match system power delivery requirements.
• Temperature & Grade  Extended grade device rated for operation from 0 °C to 100 °C for a wide range of environments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Large logic element count and substantial on-chip memory support complex signal processing and data-path implementation within a single FPGA.
• Multi-channel I/O systems  624 I/O pins enable aggregation of multiple interfaces and high fan-out connectivity for communication and control applications.
• Compact board-level integration  1924-FCBGA packaging and surface-mount mounting facilitate use in space-constrained, high-performance assemblies.

Unique Advantages

• High logic integration: 1,088,325 logic elements reduce the need for multiple devices by consolidating large designs into one FPGA.
• Significant on-chip memory: Approximately 58.27 Mbits of embedded RAM supports large buffers, packet processing, and data staging without immediate dependence on external memory.
• Extensive I/O resources: 624 user I/Os provide the flexibility to connect numerous peripherals, channels, and interfaces directly to the FPGA.
• Compact FCBGA footprint: 1924-FCBGA (45×45) package enables high-density PCB layouts while maintaining robust connectivity.
• Extended-grade operation: Rated for 0 °C to 100 °C, suitable for applications requiring broader ambient temperature tolerance than typical commercial-only devices.
• Low-voltage core operation: Core supply specified at 922 mV to 979 mV to match modern low-voltage power architectures.

Why Choose XCKU085-2FLVF1924E?

The XCKU085-2FLVF1924E positions itself as a high-capacity Kintex® UltraScale™ FPGA for designs that require substantial logic, embedded memory, and dense I/O in a compact FCBGA package. Its extended-grade rating and defined core voltage range make it suitable for systems that need reliable operation across a broad ambient temperature span and low-voltage power rails.

This device is well suited to engineers and system designers consolidating complex functions into a single programmable device, offering scalability in logic and memory resources while simplifying board-level integration through a standardized 1924-FCBGA footprint.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XCKU085-2FLVF1924E.