XCKU085-2FLVA1517E

The XCKU085-2FLVA1517E is a Kintex® UltraScale™ field programmable gate array (FPGA) supplied in a 1517‑FCBGA package. It delivers a large logic capacity with 1,088,325 logic elements and approximately 58.27 Mbits of embedded memory for complex, programmable digital designs.

Designed for board‑level surface mount assembly, this extended‑grade device provides 624 I/O and operates from a core supply of 0.922–0.979 V with an ambient operating range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Logic Capacity 1,088,325 logic elements to implement large-scale programmable logic and complex state machines.
• Embedded Memory Approximately 58.27 Mbits of on‑chip RAM for buffering, lookup tables, and distributed memory functions.
• I/O Count 624 general‑purpose I/O pins to support wide parallel interfaces and multi‑lane connectivity.
• Package 1517‑FCBGA supplier device package (40×40) for high‑density board integration and predictable thermal/mechanical characteristics.
• Power Core supply voltage range of 0.922 V to 0.979 V to match regulated FPGA power rails and enable predictable power budgeting.
• Temperature & Grade Extended grade device with an operating range of 0 °C to 100 °C suitable for controlled commercial and extended‑environment applications.
• Mounting & Compliance Surface mount FCBGA package and RoHS compliance for modern PCB assembly and environmental requirements.

Unique Advantages

• High logic density: 1,088,325 logic elements allow consolidation of complex functions into a single device, reducing BOM count and board area.
• Significant on‑chip memory: Approximately 58.27 Mbits of embedded RAM supports large buffers, packet storage, and lookup tables without relying on external SDRAM.
• Large I/O availability: 624 I/O pins provide flexibility for parallel data paths, multiple interfaces, and extensive peripheral connectivity.
• Compact, manufacturable package: 1517‑FCBGA (40×40) enables high‑density PCB layouts while supporting standard surface‑mount assembly processes.
• Predictable power envelope: Narrow core voltage range (0.922–0.979 V) simplifies power supply design and regulation for the FPGA core.
• Extended operating range and RoHS compliance: Extended grade operation to 100 °C plus RoHS compliance supports a broad set of commercial and extended‑environment deployments.

Why Choose XCKU085-2FLVA1517E?

The XCKU085-2FLVA1517E positions itself as a high‑capacity Kintex® UltraScale™ FPGA optimized for designs that need many logic elements, substantial embedded memory, and a large number of I/Os in a single, surface‑mount FCBGA package. Its extended grade rating and defined core voltage range make it suitable for engineers balancing performance, integration density, and predictable power/thermal planning.

This device is well suited for teams developing complex digital systems that benefit from consolidating functions into one programmable IC—reducing component count, simplifying routing, and leveraging on‑chip memory and I/O resources for scalable designs.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU085-2FLVA1517E. Our team can assist with lead times and procurement details tailored to your project needs.