XCKU085-2FLVB1760E

The XCKU085-2FLVB1760E is a Kintex® UltraScale™ Field Programmable Gate Array delivered in a 1760-ball FCBGA package. It provides high logic capacity and on-chip memory in a surface-mount package targeted at applications requiring significant programmable fabric and a large number of I/O.

With 1,088,325 logic elements and approximately 58.3 Mbits of embedded memory, this FPGA balances density and I/O capacity (676 I/O) while operating across a 0 °C to 100 °C range and a nominal supply window of 922 mV to 979 mV.

Key Features

• Core Logic Provides 1,088,325 logic elements and 62,190 logic blocks to implement complex digital logic and custom datapaths.
• Embedded Memory Approximately 58.3 Mbits of on-chip RAM (58,265,600 bits) for buffering, frame storage, and memory-centric accelerators.
• I/O Capacity 676 general-purpose I/O pins to support high-port-count interfaces and parallel I/O requirements.
• Package and Mounting 1760-ball FCBGA package (1760-BBGA, 42.5 × 42.5 mm) in a surface-mount form factor for compact board integration.
• Power Specified operating supply range from 922 mV to 979 mV to align with targeted power rails and design constraints.
• Temperature and Grade Extended-grade device rated for operation from 0 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density signal processing — Use the large logic element count and on-chip RAM for FPGA-based DSP, data aggregation, and parallel processing pipelines.
• Multi-channel interface aggregation — 676 I/O enable high port counts for bridging, protocol aggregation, or large sensor arrays.
• Platform and system integration — The 1760-FCBGA surface-mount package supports compact system boards that require substantial programmable logic and memory resources.

Unique Advantages

• Large programmable capacity: 1,088,325 logic elements allow implementation of complex state machines, accelerators, and custom controllers on a single device.
• Significant on-chip memory: Approximately 58.3 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage needs.
• High I/O density: 676 I/O pins enable direct interfacing with numerous peripherals, sensors, or parallel data channels without external multiplexing.
• Compact FCBGA form factor: 1760-ball, 42.5 × 42.5 mm package supports high-density board designs while maintaining surface-mount assembly.
• Extended operating range: Rated 0 °C to 100 °C for designs that require extended-grade components and consistent operation within that window.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and materials compliance.

Why Choose XCKU085-2FLVB1760E?

The XCKU085-2FLVB1760E positions itself where high programmable logic density, substantial on-chip memory, and broad I/O count are required in a compact surface-mount FCBGA package. Its combination of more than one million logic elements, approximately 58.3 Mbits of embedded RAM, and 676 I/Os makes it suitable for designs that consolidate complex digital functions into a single FPGA device.

This device is a fit for teams and systems that need scalable logic resources and significant embedded memory capacity while operating within an extended temperature range and defined supply window. Its RoHS compliance and standard FCBGA footprint support integration into modern production flows.

Request a quote or submit a procurement inquiry to obtain pricing and availability for XCKU085-2FLVB1760E.