XCKU085-2FLVB1760I

The XCKU085-2FLVB1760I is an AMD Kintex® UltraScale™ field programmable gate array in a 1760-FCBGA package. It provides a large pool of programmable logic and embedded memory together with a high I/O count, packaged for surface-mount assembly and rated for industrial temperature operation.

This device is suited for designs that require extensive on-chip logic resources, substantial embedded memory, and dense external interfacing, while meeting RoHS compliance and an industrial operating temperature window.

Key Features

• Core Logic  Approximately 62,190 configurable logic blocks and 1,088,325 logic cells provide extensive programmable logic capacity for complex designs.
• Embedded Memory  Approximately 58.3 Mbits of on-chip RAM available for buffering, state storage, and data processing tasks.
• I/O Capacity  676 I/O pins support dense external connectivity and flexible interfacing options.
• Power  Core supply voltage specified between 922 mV and 979 mV to match system power requirements.
• Package and Mounting  1760-FCBGA package (42.5×42.5 mm) in a surface-mount form factor for high-density board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Use the device’s large logic and memory resources to implement real-time control, signal processing, and custom interfacing in industrial equipment.
• High-Density I/O Platforms  Leverage 676 I/O pins for applications requiring extensive sensor, actuator, or peripheral connectivity on a single FPGA.
• Data Buffering and Processing  Embedded memory capacity supports buffering, packet handling, and intermediate data storage for processing pipelines.
• Custom Logic Integration  Integrate custom protocols and mixed-function logic into one programmable device to consolidate system functions and reduce board-level complexity.

Unique Advantages

• Extensive Programmable Resources:  Over one million logic cells and tens of thousands of configurable logic blocks enable complex, highly customized logic implementations.
• Substantial On-Chip Memory:  Approximately 58.3 Mbits of embedded RAM minimizes reliance on external memory for many buffering and temporary storage needs.
• High I/O Density:  676 I/Os reduce the need for external multiplexing or expansion, simplifying board design for dense connectivity requirements.
• Industrial Robustness:  Rated for −40 °C to 100 °C operation, supporting deployment in systems exposed to wide temperature ranges.
• Compact, Surface-Mount Package:  1760-FCBGA (42.5×42.5 mm) fits high-density PCB layouts while supporting automated assembly processes.
• Regulatory Compatibility:  RoHS compliance helps streamline manufacturing and environmental conformity.

Why Choose XCKU085-2FLVB1760I?

The XCKU085-2FLVB1760I combines large-scale programmable logic, significant embedded memory, and a very high I/O count in a surface-mount 1760-FCBGA package, presented in an industrial-grade temperature window. This combination makes it well suited for engineers designing complex, connected systems that require on-chip integration of logic and memory while meeting environmental and assembly requirements.

Choose this AMD Kintex® UltraScale™ FPGA when your design demands scalable logic capacity, substantial on-chip RAM, and dense external interfacing, all within a device qualified for industrial temperature operation and RoHS-compliant production.

Request a quote or submit a sales inquiry to obtain pricing and availability for the XCKU085-2FLVB1760I.