XCKU085-1FLVF1924I

The XCKU085-1FLVF1924I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1924-FCBGA package. It provides a high density of programmable logic and embedded memory for complex digital designs, delivered in an industrial-grade, surface-mount form factor.

With an extensive I/O complement and a defined low-voltage supply range, this device is suited to designs that require substantial on-chip resources and operation across a wide temperature range.

Key Features

• Core Logic 1,088,325 logic elements and 62,190 CLBs provide a large programmable fabric for implementing complex logic and control functions.
• Embedded Memory Approximately 58 Mbits of on-chip RAM (58,265,600 total RAM bits) for buffers, lookup tables and data storage within the FPGA fabric.
• I/O Density 624 I/O pins support extensive connectivity to external devices, sensors, and peripherals.
• Package & Mounting 1924-BBGA, FCBGA package with supplier device package 1924-FCBGA (45×45), designed for surface-mount PCB assembly.
• Power Operates from a specified supply range of 922 mV to 979 mV for the core domain.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal demands of industrial environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Use the device to implement programmable control logic and data handling in industrial equipment that requires operation across −40 °C to 100 °C.
• High‑Density Digital Systems Deploy the large logic element and memory capacity to consolidate complex digital functions onto a single FPGA.
• Interface and I/O Aggregation Leverage 624 I/O pins for extensive peripheral interfacing, signal conditioning, and protocol bridging on a single board.

Unique Advantages

• High-density programmable fabric: 1,088,325 logic elements enable integration of large and complex logic designs without excessive external components.
• Substantial embedded memory: Approximately 58 Mbits of on-chip RAM supports buffers, FIFOs and data tables close to the logic for lower-latency operation.
• Extensive I/O capability: 624 I/O pins provide flexibility for multi-channel interfaces and broad peripheral connectivity.
• Industrial-grade thermal range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
• Compact FCBGA package: 1924-FCBGA (45×45) surface-mount package offers a high-density footprint for space-constrained PCB designs.
• Low-voltage core operation: Core supply range of 922 mV to 979 mV aligns with modern low-voltage system domains.

Why Choose XCKU085-1FLVF1924I?

The XCKU085-1FLVF1924I combines a very high logic element count with substantial embedded memory and a large I/O complement in an industrial-grade, surface-mount FCBGA package. It is positioned for designs that require significant on-chip resources and robust thermal performance.

This device is suitable for engineers and procurement teams targeting complex programmable logic implementations that demand integration, scalability and consistent operation across a wide temperature range, while conforming to RoHS requirements.

Request a quote or submit a purchase inquiry to begin procurement for the XCKU085-1FLVF1924I.