XCKU085-1FLVB1760I

The XCKU085-1FLVB1760I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for high-density, programmable logic applications. It combines a large logic fabric with substantial on-chip memory and extensive I/O capability to address complex digital designs in industrial environments.

With 1,088,325 logic elements and approximately 58.3 Mbits of embedded memory, this device targets systems that require significant programmable logic resources, wide I/O connectivity, and reliable operation across an industrial temperature range.

Key Features

• Logic Capacity  1,088,325 logic elements provide a large programmable fabric for complex logic, state machines, and custom compute pipelines.
• Embedded Memory  Approximately 58.3 Mbits of on-chip RAM for buffering, lookup tables, and local data storage to support high-throughput designs.
• I/O Count  676 user I/Os to support broad peripheral interfacing, parallel data lanes, and multi-channel connectivity requirements.
• Power Supply  Operating supply range from 922 mV to 979 mV to match system power delivery specifications.
• Package & Mounting  1760-FCBGA package (1760-BBGA, supplier device package 1760-FCBGA 42.5 × 42.5 mm) with surface-mount mounting type for compact board-level integration.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for robust performance in demanding environments.
• Regulatory  RoHS compliant to meet lead-free and environmental material requirements.

Typical Applications

• High-density logic systems  Implement complex digital functions and custom accelerators that require extensive logic resources and on-chip memory.
• Data buffering and processing  Use the embedded RAM for packet buffering, frame storage, or intermediate data staging in streaming applications.
• Multi-channel I/O interfaces  Support designs with large numbers of parallel or serialized interfaces leveraging 676 I/Os for comprehensive system connectivity.

Unique Advantages

• Large programmable fabric: 1,088,325 logic elements enable integration of multiple subsystems on a single device, reducing board-level complexity.
• Significant on-chip memory: Approximately 58.3 Mbits of embedded RAM supports local data storage and high-throughput buffering without external memory.
• Extensive I/O resources: 676 I/Os allow flexible interfacing options for sensors, transceivers, and custom peripherals.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in environments that demand extended temperature performance.
• Compact, surface-mount package: 1760-FCBGA (42.5 × 42.5 mm) provides high pin density in a board-friendly form factor for space-constrained designs.
• RoHS compliance: Meets environmental material standards for lead-free assembly and regulatory requirements.

Why Choose XCKU085-1FLVB1760I?

The XCKU085-1FLVB1760I positions itself as a high-capacity, industrial-grade FPGA solution that balances large logic and memory resources with wide I/O connectivity and robust temperature tolerance. It is suited for engineers and teams building advanced digital systems that require significant on-chip resources and reliable operation in demanding conditions.

Choosing this device supports designs that need scalability in logic, embedded memory for data-heavy tasks, and extensive interfacing options, providing long-term value through reduced system complexity and board-level consolidation.

Request a quote or submit an inquiry to obtain pricing and availability for XCKU085-1FLVB1760I. Our team can provide lead-time and purchasing information to support your design schedule.