XCKU060-L1FFVA1517I

The XCKU060-L1FFVA1517I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC offering high logic density, substantial embedded memory, and extensive I/O in a surface-mount FCBGA package. It is supplied in a 1517-FCBGA (40×40) package and is specified for industrial-grade operation across a -40°C to 100°C temperature range.

With 725,550 logic elements, approximately 39 Mbits of on-chip RAM, and 624 I/O, this device targets designs that require large programmable logic capacity, significant embedded memory, and high pin count integration while operating from a core voltage in the 880 mV to 979 mV range.

Key Features

• Core Logic  Provides 725,550 logic elements for high-density programmable logic implementations and complex digital designs.
• Embedded Memory  Approximately 39 Mbits of on-chip RAM to support buffering, state storage, and memory-hungry logic functions.
• I/O Capacity  624 available I/O pins to support multi-channel interfaces, high-pin-count peripheral integration, and board-level consolidation.
• Package & Mounting  Supplied in a 1517-FCBGA (40×40) package case with surface-mount mounting for compact, high-density PCB assembly.
• Power  Specified core voltage range from 880 mV to 979 mV to match system power-rail planning and supply design constraints.
• Temperature & Grade  Industrial grade device rated for operation from -40°C to 100°C for deployment in temperature-variable environments.
• Compliance  RoHS compliant for regulatory alignment with lead-free manufacturing and materials requirements.

Typical Applications

• High-density programmable logic systems  Use the device where large numbers of logic elements and embedded memory are required to implement complex custom logic and state machines.
• Multi-channel I/O aggregation  Leverage 624 I/O pins to consolidate multiple interfaces and sensors on a single FPGA for system-level integration.
• Industrial control and monitoring  Industrial-grade temperature range and surface-mount FCBGA packaging support deployment in industrial equipment and control systems.

Unique Advantages

• High logic capacity: 725,550 logic elements enable implementation of large, complex designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 39 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O count: 624 I/O pins facilitate direct connection to multiple peripherals and high-channel-count interfaces, simplifying board-level routing.
• Industrial operating range: Rated from -40°C to 100°C to meet temperature requirements common in industrial applications.
• Compact FCBGA package: 1517-FCBGA (40×40) surface-mount package supports high-density PCB assembly and reliable soldered connections.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmental and regulatory compatibility.

Why Choose XCKU060-L1FFVA1517I?

The XCKU060-L1FFVA1517I combines high logic density, significant embedded memory, and a large I/O complement in an industrial-grade FCBGA package, making it well suited for designs that demand integration and scalability within constrained board footprints. Its specified voltage range and operating temperature make it a practical choice for development teams focused on robust, high-capacity programmable solutions.

This device is appropriate for engineering teams and procurement organizations seeking a high-density FPGA platform that supports complex logic, extensive I/O, and on-chip memory—providing long-term design flexibility and consolidation potential within the Kintex UltraScale family.

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