XCKU060-3FFVA1156E

The XCKU060-3FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable fabric with 725,550 logic elements and approximately 38.9 Mbits of embedded memory for complex digital designs.

This device targets systems that require large logic capacity, substantial on-chip memory and a high I/O count, all in a 1156-FCBGA (35×35) surface-mount package. The part is graded as Extended and operates from 0 °C to 100 °C with a core supply range of 970 mV to 1.03 V.

Key Features

• High-capacity Logic — 725,550 logic elements provide a large programmable fabric for complex logic implementations and parallel processing.
• Embedded Memory — Approximately 38.9 Mbits of total RAM bits to support buffering, large state machines and memory-intensive algorithms.
• High I/O Count — 520 user I/O pins to connect to wide external buses, multiple peripherals or high-channel-count systems.
• Package and Mounting — 1156-BBGA / 1156-FCBGA supplier device package (35×35) in a surface-mount form factor for compact board integration.
• Power — Core voltage supply specified from 970 mV to 1.03 V to align with system power designs.
• Temperature and Grade — Extended grade device rated for operation from 0 °C to 100 °C and RoHS compliant for environmental compliance.
• Logic Block Count — 41,460 CLB units to structure logic resources across the fabric (reported as CLBs).

Typical Applications

• Large-scale digital systems — Use the high logic element count and extensive memory to implement complex digital processing and control functions.
• High-channel I/O designs — Leverage 520 I/O pins for wide parallel interfaces, multi-channel data acquisition or dense peripheral connectivity.
• Memory-intensive buffering — Approximately 38.9 Mbits of embedded RAM supports packet buffering, FIFO architectures and large state storage.

Unique Advantages

• High logic density: 725,550 logic elements enable consolidation of large amounts of functionality into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 38.9 Mbits of RAM provides on-chip storage for data path staging and complex algorithms without immediate external memory dependency.
• Extensive I/O capability: 520 I/O pins support broad external interfacing, simplifying integration with multiple buses and peripherals.
• Compact FCBGA package: 1156-FCBGA (35×35) surface-mount package offers a high-pin-count solution in a compact footprint for space-constrained designs.
• Extended operating range: Extended grade and 0 °C to 100 °C operating temperature accommodate a wide set of commercial and industrial-adjacent environments.
• Controlled core supply: Narrow core voltage range (970 mV to 1.03 V) aids predictable power design and supply planning.

Why Choose XCKU060-3FFVA1156E?

The XCKU060-3FFVA1156E combines a large programmable fabric, significant embedded memory and a high I/O count in a compact 1156-FCBGA package, making it suitable for designs that demand concentrated logic resources and substantial on-chip RAM. As an AMD Kintex® UltraScale™ device, it provides the capacity to implement complex digital functions while maintaining a defined power and thermal profile (970 mV–1.03 V core; 0 °C–100 °C operating range).

This part is well suited to engineering teams and procurement looking for a high-density FPGA solution with extended-grade operation and RoHS compliance, enabling builds that require consolidated logic, memory-intensive operations and broad external connectivity.

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