XCKU060-2FFVA1156I

The XCKU060-2FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) device that provides a large pool of programmable logic, embedded memory, and abundant I/O in a single surface-mount package. The device includes 41,460 CLBs and 725,550 logic elements, with approximately 39 Mbits of embedded memory to support complex digital designs.

This industrial-grade FPGA is supplied in a 1156-FCBGA (35×35) package with 520 I/O pins, a supply voltage range of 922 mV to 979 mV, and an operating temperature range of -40 °C to 100 °C. The device is RoHS compliant for regulatory alignment.

Key Features

• Core Logic 41,460 configurable logic blocks (CLBs) and 725,550 logic elements (cells) for extensive programmable logic resources.
• Embedded Memory Approximately 39 Mbits of on-chip RAM (38,912,000 bits) for buffering, lookup tables, and state storage.
• I/O Capacity 520 available I/O pins to support multiple external interfaces and parallel signal routing requirements.
• Power Supply Specified operating voltage range of 922 mV to 979 mV.
• Package & Mounting 1156-BBGA (FCBGA) supplier device package — 1156-FCBGA (35×35) — supplied as a surface-mount component.
• Operating Range & Grade Industrial grade device rated for operation from -40 °C to 100 °C.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High logic capacity: 725,550 logic elements provide extensive programmable resources to implement complex designs without external logic expansion.
• Substantial on-chip memory: Approximately 39 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention.
• Extensive I/O connectivity: 520 I/O pins enable broad interfacing options for multi-channel and mixed-signal systems.
• Industrial readiness: Rated to operate from -40 °C to 100 °C for use in temperature-variable environments.
• Compact integration: 1156-FCBGA (35×35) surface-mount package consolidates high resource counts in a single, manufacturable footprint.
• Regulatory alignment: RoHS compliance supports integration into compliant manufacturing flows.

Why Choose XCKU060-2FFVA1156I?

The XCKU060-2FFVA1156I delivers a combination of large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade surface-mount package. These characteristics make it suitable for designs that require consolidated programmable logic resources and robust operating temperature margins.

For teams and projects that need a high-resource FPGA with a compact 1156-FCBGA footprint and clear supply and temperature specifications, the XCKU060-2FFVA1156I provides a verifiable specification set to base procurement and system-design decisions on.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XCKU060-2FFVA1156I.