XCKU060-1FFVA1517I

IC FPGA 624 I/O 1517FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 624 38912000 725550 1517-BBGA, FCBGA

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O624Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs41460Number of Logic Elements/Cells725550
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits38912000

Overview of XCKU060-1FFVA1517I – Kintex® UltraScale™ FPGA, 1517-FCBGA

The XCKU060-1FFVA1517I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD designed for industrial-grade applications. It combines high logic density, substantial embedded memory, and a large I/O count to support complex, configurable digital designs.

With 725,550 logic elements and approximately 38.9 Mbits of on-chip RAM, this 1517-FCBGA (40×40) surface-mount device targets systems that require extensive programmable logic, abundant embedded memory, and robust I/O capability across an operating range of -40 °C to 100 °C.

Key Features

  • Core Logic  725,550 logic elements and 41,460 configurable logic blocks (CLBs) provide large-scale programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 38.9 Mbits of on-chip RAM to support data buffering, lookup tables, and intermediate storage within FPGA designs.
  • I/O Capacity  624 user I/O pins for broad peripheral and interface connectivity without external multiplexing.
  • Power  Voltage supply operating range from 922 mV to 979 mV to match system power domains and design constraints.
  • Package & Mounting  1517-BBGA (1517-FCBGA 40×40) package in a surface-mount form factor for PCB integration in compact systems.
  • Industrial Grade & Temperature  Rated for industrial-grade operation with an ambient temperature range of -40 °C to 100 °C to support demanding environments.
  • Compliance  RoHS-compliant construction for environmentally conscious design and regulatory alignment.

Typical Applications

  • Industrial Control & Automation  Use the device’s industrial temperature rating and large logic capacity for motor control, PLC logic, and real-time control functions.
  • Communications & Networking  Leverage high I/O count and extensive logic resources to implement protocol processing, packet handling, and custom interface logic.
  • Signal Processing & Instrumentation  Employ the embedded memory and logic density for buffering, filtering, and real-time data manipulation in test and measurement equipment.
  • Custom Hardware Acceleration  Map compute-intensive kernels into FPGA fabric using abundant logic elements and on-chip RAM for application-specific acceleration.

Unique Advantages

  • High logic density: 725,550 logic elements enable integration of large or multiple functions on a single device, reducing system complexity.
  • Significant on-chip RAM: Approximately 38.9 Mbits of embedded memory supports data-heavy designs without immediate external memory dependence.
  • Extensive I/O: 624 I/O pins provide flexibility to connect numerous peripherals and interfaces directly to the FPGA fabric.
  • Industrial temperature range: Rated from -40 °C to 100 °C for deployment in demanding environmental conditions common to industrial systems.
  • Compact surface-mount package: 1517-FCBGA (40×40) packaging enables dense PCB layouts while maintaining high pin count.
  • RoHS compliant: Meets environmental compliance requirements for modern electronic product design.

Why Choose XCKU060-1FFVA1517I?

The XCKU060-1FFVA1517I positions itself as a high-capacity, industrial-grade Kintex UltraScale FPGA suitable for designs that require substantial programmable logic, embedded memory, and a large number of I/Os in a compact surface-mount package. Its combination of 725,550 logic elements, approximately 38.9 Mbits of on-chip RAM, and 624 I/Os makes it well suited to complex control, communications, and signal-processing applications.

Provided by AMD and supplied in a 1517-FCBGA package, this FPGA offers a scalable hardware platform for engineering teams seeking to consolidate functionality, maintain robust operation across industrial temperatures, and accelerate time-to-market for configurable digital systems.

Request a quote or submit a procurement inquiry to evaluate the XCKU060-1FFVA1517I for your next FPGA-based design.

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