XCKU060-2FFVA1517E

The XCKU060-2FFVA1517E is a Kintex® UltraScale™ FPGA IC from AMD designed for applications that require high logic capacity, substantial embedded memory, and a large I/O complement. Its architecture delivers a combination of logic density, on-chip memory, and I/O resources suitable for complex digital designs.

This device is provided in a 1517-FCBGA (40×40) surface-mount package and is rated for extended-grade operation with a defined supply voltage range and operating temperature window, making it suitable for a range of electronic systems where those electrical and environmental conditions apply.

Key Features

• Logic Capacity  725,550 logic elements for implementing large-scale digital logic and complex processing pipelines.
• Embedded Memory  Approximately 39 Mbits of on-chip RAM (38,912,000 bits) to support buffering, frame storage, and intermediate data structures without external memory.
• I/O Resources  624 I/O pins to support wide peripheral interfacing, parallel data lanes, and multiple external device connections.
• Power Supply Range  Specified supply voltage range from 922 mV to 979 mV for core power planning and regulator selection.
• Package and Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FCBGA (40×40)); surface-mount mounting type for standard PCB assembly workflows.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C to match designs targeting this thermal envelope.
• Regulatory Compliance  RoHS compliant status for alignment with lead-free and restricted-substance requirements.

Unique Advantages

• High logic density: 725,550 logic elements provide the capacity to consolidate complex functions and reduce the need for multiple devices.
• Significant on-chip memory: Approximately 39 Mbits of embedded RAM reduces external memory dependencies for many buffering and storage tasks.
• Large I/O count: 624 I/Os enable broad connectivity to peripherals, sensors, and high-throughput interfaces without extensive board-level multiplexing.
• Defined supply and thermal envelope: Clear voltage (922–979 mV) and operating temperature (0 °C–100 °C) specifications simplify power and thermal design considerations.
• Standard surface-mount FCBGA packaging: The 1517-FCBGA (40×40) package supports conventional PCB assembly and compact system integration.
• RoHS compliance: Conforms to lead-free and restricted substance expectations for many commercial and industrial applications.

Why Choose XCKU060-2FFVA1517E?

The XCKU060-2FFVA1517E positions itself as a high-capacity FPGA option within the Kintex® UltraScale™ family, offering a balance of large logic resources, substantial embedded memory, and a high I/O count. Its defined power and temperature specifications and extended-grade rating make it appropriate for designs that must meet those specific electrical and environmental parameters.

This device is suitable for engineering teams and procurement groups seeking a single-chip solution that can integrate significant digital functionality while fitting standard surface-mount assembly processes. Backed by AMD as the manufacturer, it provides a clear specification set for system-level power, thermal, and PCB planning.

Request a quote or submit a pricing inquiry for XCKU060-2FFVA1517E to get availability and lead-time information specific to your project needs.