XCKU060-3FFVA1517E

The XCKU060-3FFVA1517E is a Kintex® UltraScale™ FPGA IC from AMD, provided in a 1517-ball FCBGA package (40×40). It delivers a large programmable logic capacity and substantial on-chip RAM for designs that require extensive logic resources and significant embedded memory.

Key technical characteristics include 725,550 logic elements, approximately 39 Mbits of embedded memory, 624 I/O pins, a core voltage range of 0.970–1.03 V, and an extended operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity — 725,550 logic elements for implementing large-scale programmable logic and complex combinational/sequential designs.
• Embedded Memory — Approximately 39 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
• I/O — 624 I/O pins to support wide external interfacing and high pin-count system integration.
• Core Voltage — Operates from 0.970 V to 1.03 V, supporting designs with specified low-voltage core requirements.
• Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package supplied in a surface-mount form factor for board-level integration.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for applications within that ambient range.
• Regulatory Status — RoHS compliant.

Typical Applications

• High-density programmable systems — Use the large logic element count to implement complex, custom logic functions and large-scale state machines.
• Memory-intensive designs — Leverage approximately 39 Mbits of embedded RAM for buffering, FIFOs, or on-chip storage in data-path and packet-processing designs.
• Multi-interface systems — Utilize 624 I/Os to connect numerous peripherals, high-pin-count connectors, or multi-lane interfaces.

Unique Advantages

• Substantial logic resources: 725,550 logic elements enable dense mapping of algorithms and large IP blocks without immediate device migration.
• Significant on-chip memory: Approximately 39 Mbits of RAM reduces reliance on external memory for many buffering and caching tasks, simplifying board design.
• High I/O count: 624 I/Os support complex interconnect requirements and multi-channel system designs.
• Compact, board-ready package: 1517-FCBGA (40×40) surface-mount package facilitates integration into compact PCBs and high-density assemblies.
• Design-ready electrical profile: Core voltage range of 0.970–1.03 V allows compatibility with designs that specify a narrow low-voltage core rail.

Why Choose XCKU060-3FFVA1517E?

The XCKU060-3FFVA1517E positions itself as a high-capacity, memory-rich FPGA option for designs that require extensive programmable logic, substantial embedded RAM, and a high pin count. Its 1517-FCBGA surface-mount package and extended-grade operating range make it suitable for system designs operating within 0 °C to 100 °C that need dense integration on compact PCBs.

This device delivers a combination of logic density, on-chip memory, and I/O capacity that helps designers consolidate functionality, reduce external component count, and scale complex digital and data-path implementations while maintaining compliance with RoHS requirements.

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