XCKU085-1FLVA1517C

The XCKU085-1FLVA1517C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It integrates approximately 1,088,325 logic elements and approximately 58.3 Mbits of embedded memory in a 1517‑FCBGA (40×40) package intended for surface-mount assembly.

With 624 I/O pins, a commercial operating temperature range of 0 °C to 85 °C, and a supply range of 922 mV to 979 mV, this device addresses designs that require high logic density, substantial on-chip RAM, and dense I/O in a compact FCBGA footprint.

Key Features

• Kintex® UltraScale™ FPGA core — Field Programmable Gate Array architecture designed for programmable logic implementations.
• Logic capacity — Approximately 1,088,325 logic elements supporting large-scale logic designs.
• Embedded memory — Total on-chip RAM of 58,265,600 bits (approximately 58.3 Mbits) for reduced external memory dependence.
• High I/O density — 624 user I/O pins to accommodate extensive peripheral and signaling requirements.
• Package and mounting — 1517‑BBGA / 1517‑FCBGA (supplier device package: 1517‑FCBGA 40×40) in a surface-mount format for compact board designs.
• Power supply range — Supply voltage specified from 922 mV to 979 mV to match system power delivery planning.
• Operating range and grade — Commercial grade operation from 0 °C to 85 °C.
• Environmental compliance — RoHS compliant.

Typical Applications

• High‑density programmable logic systems — Use the large logic element count to implement complex custom logic and processing pipelines on-chip.
• Memory‑intensive designs — Leverage approximately 58.3 Mbits of embedded memory to minimize external memory requirements for buffering and data storage.
• I/O‑rich interfaces and controllers — 624 I/Os support multiple high‑pin-count interfaces, sensor arrays, and peripheral connections.
• Compact, surface‑mount deployments — The 1517‑FCBGA (40×40) package enables high integration in space‑constrained board layouts.

Unique Advantages

• High logic capacity: Approximately 1,088,325 logic elements allow implementation of sizable programmable designs without partitioning across devices.
• Substantial on‑chip memory: About 58.3 Mbits of embedded RAM reduces dependency on external memory and simplifies BOM.
• Dense I/O connectivity: 624 I/Os provide flexibility for complex interfacing and multiple parallel channels.
• Compact FCBGA footprint: 1517‑FCBGA (40×40) supports high‑density PCB layouts while remaining surface‑mount compatible.
• Predictable operating envelope: Commercial temperature rating (0 °C to 85 °C) and defined supply range (922 mV–979 mV) aid system power and thermal planning.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assemblies.

Why Choose XCKU085-1FLVA1517C?

The XCKU085-1FLVA1517C pairs a large logic fabric with significant embedded memory and a high I/O count in a compact 1517‑FCBGA package, making it a strong choice for designs that require on‑chip integration of complex logic, buffering, and extensive peripheral connectivity. Its commercial temperature range and defined supply window support predictable deployment in standard embedded and electronic systems.

This device is well suited for developers and procurement teams specifying FPGAs where on‑chip resources can reduce external components, simplify board design, and consolidate functionality into a single surface‑mount package while maintaining RoHS compliance.

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