XCKU085-1FLVB1760C

The XCKU085-1FLVB1760C is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD supplied in a 1760-FCBGA (42.5 × 42.5 mm) package. This commercial-grade, surface-mount FPGA provides a high count of logic elements, extensive embedded memory, and a large I/O complement for complex programmable-logic designs.

It is intended for applications that require substantial on-chip logic and memory capacity, with clearly defined electrical and thermal operating ranges for integration into system-level designs.

Key Features

• High-density logic — 1,088,325 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded memory — approximately 58.3 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O capacity — 676 I/O pins to support broad interfacing requirements with peripherals, sensors, and high-pin-count system connectors.
• Package — 1760-BBGA, FCBGA package in a 1760-FCBGA (42.5 × 42.5 mm) footprint, optimized for high-density board integration and surface-mount assembly.
• Power supply — specified supply voltage range of 922 mV to 979 mV for core operation, enabling predictable power design and regulation planning.
• Operating conditions — commercial-grade device rated for 0 °C to 85 °C ambient operation.
• RoHS compliance — meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• High-density programmable logic systems — deploy the large logic element count and embedded RAM for complex custom logic and state-machine implementations.
• Data buffering and packet processing — use the on-chip RAM and extensive I/O to implement buffering, packet handling, and interface bridging functions.
• Custom interface and I/O aggregation — leverage 676 I/Os to consolidate and manage multiple peripheral interfaces on a single FPGA.

Unique Advantages

• Large on-chip resources: Over one million logic elements and approximately 58.3 Mbits of embedded memory provide capacity for complex, integrated designs without immediate reliance on external components.
• Extensive I/O support: 676 I/Os enable flexible connectivity and simplify board-level routing for systems with many signals or multiple peripheral domains.
• Compact, manufacturable package: 1760-FCBGA surface-mount package (42.5 × 42.5 mm) supports high-density PCB designs and industry-standard assembly processes.
• Defined electrical and thermal envelope: Specified core supply range (922 mV–979 mV) and commercial operating temperature (0 °C–85 °C) allow predictable system power and thermal planning.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and regulatory requirements for many supply chains.

Why Choose XCKU085-1FLVB1760C?

The XCKU085-1FLVB1760C positions itself as a high-capacity Kintex® UltraScale™ FPGA offering a substantial resource set—logic, embedded memory, and I/O—packaged for surface-mount integration. Its specifications make it suitable for engineers building complex programmable logic systems that require significant on-chip resources while operating within a commercial temperature range.

Designed for scalable, high-density designs, this FPGA is a fit for development teams and procurement professionals looking for a robust, RoHS-compliant programmable logic device with defined supply and thermal parameters and a large I/O footprint.

Request a quote or contact sales to discuss availability, pricing, and how XCKU085-1FLVB1760C can fit into your next design.