XCKU060-L1FFVA1156I

The AMD XCKU060-L1FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1156-BBGA (1156-FCBGA) surface-mount package. It provides a large programmable fabric with 725,550 logic elements, approximately 39 Mbits of embedded memory, and 520 available I/O, targeted for industrial-grade applications.

Designed for deployments that require substantial logic density and high I/O count within a compact FCBGA footprint, this device operates over an industrial temperature range and supports a defined core supply window for system integration.

Key Features

• Core architecture Kintex® UltraScale™ FPGA family device offering programmable logic resources for custom hardware acceleration and logic-intensive designs.
• Logic capacity 725,550 logic elements to implement large, complex logic designs and state machines.
• Embedded memory Approximately 39 Mbits of on-chip RAM (38,912,000 bits total) for buffering, FIFOs, and local data storage.
• I/O resources 520 I/O pins to support dense peripheral interfacing and multi-channel signal connectivity.
• Power supply Core supply operating range from 880 mV to 979 mV to align with specified system power rails.
• Package and mounting 1156-FCBGA package (35×35 mm), surface-mount, suitable for compact board-level implementations.
• Temperature and grade Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental compliance RoHS compliant.

Unique Advantages

• High logic density: 725,550 logic elements provide ample programmable fabric for complex algorithms and parallel processing.
• Substantial on-chip memory: Approximately 39 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path needs.
• Extensive I/O capacity: 520 I/O pins enable broad interfacing options for multi-channel and multi-protocol designs.
• Industrial temperature performance: Rated −40 °C to 100 °C to support systems operating across wide thermal environments.
• Compact, board-ready package: 1156-FCBGA (35×35 mm) surface-mount package simplifies PCB layout for high-density designs.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU060-L1FFVA1156I?

The XCKU060-L1FFVA1156I combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 1156-FCBGA package, making it suitable for industrial applications that require significant programmable resources and robust thermal performance. Its defined core voltage range and surface-mount FCBGA footprint support integration into tightly packaged, power-conscious designs.

This device is appropriate for engineering teams and procurement groups seeking an industrial-grade Kintex® UltraScale™ FPGA with verifiable logic, memory, I/O, package, and temperature specifications for long-term deployment.

Request a quote or submit an inquiry to receive pricing and availability details for the XCKU060-L1FFVA1156I.