XCKU085-1FLVA1517I

The XCKU085-1FLVA1517I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD in a 1517-FCBGA (40×40) package. It delivers a high logic capacity and substantial on-chip RAM in a surface-mount, industrial-grade package.

Key device attributes include approximately 1,088,325 logic elements, roughly 58.3 Mbits of embedded memory, 624 I/O pins, an industrial operating temperature range from -40 °C to 100 °C, and a specified supply range of 922 mV to 979 mV.

Key Features

• Core Logic  Approximately 1,088,325 logic elements for implementing large, complex programmable logic designs.
• Embedded Memory  Approximately 58.3 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions without external memory in some designs.
• I/O Capacity  624 I/O pins to accommodate wide parallel interfaces and multiple high-density connectivity requirements.
• Package & Mounting  1517-FCBGA (40×40) package in a surface-mount form factor for compact board-level integration.
• Power  Specified core supply range of 922 mV to 979 mV to match system power-rail requirements.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C for use in temperature-challenging environments.
• Environmental Compliance  RoHS compliant for alignment with common material-restriction requirements.

Typical Applications

• High-density programmable logic designs — Deploy large-scale custom logic that leverages the device's approximately 1,088,325 logic elements and substantial embedded memory.
• Memory-intensive processing — Use the ~58.3 Mbits of on-chip RAM for buffering, packet handling, or intermediate data storage to reduce external memory dependencies.
• High-pin-count interfaces — Support multiple wide-parallel or multi-channel interfaces with up to 624 I/O pins in a compact FCBGA footprint.

Unique Advantages

• High logic density: The large count of logic elements enables consolidation of complex functions into a single FPGA, simplifying system architecture.
• Substantial embedded memory: Approximately 58.3 Mbits of on-chip RAM reduces the need for external memory in many designs, lowering BOM and board complexity.
• Extensive I/O: 624 I/O pins provide flexibility for interfacing to multiple peripherals, buses, and parallel data channels.
• Industrial temperature rating: Specified operation from -40 °C to 100 °C supports reliable use in temperature-challenging environments.
• Compact FCBGA package: The 1517-FCBGA (40×40) package offers a high-pin-count solution in a space-efficient footprint for dense PCB layouts.
• RoHS compliance: Meets material-restriction requirements for environmentally conscious designs.

Why Choose XCKU085-1FLVA1517I?

The XCKU085-1FLVA1517I positions itself as a high-capacity Kintex® UltraScale™ FPGA option for designs that require large programmable logic resources, significant on-chip RAM, and extensive I/O in an industrial-grade package. Its combination of approximately 1,088,325 logic elements, roughly 58.3 Mbits of embedded memory, and 624 I/Os makes it suitable for consolidating complex functions and reducing external component count.

Packaged in a 1517-FCBGA (40×40) surface-mount form factor and rated for -40 °C to 100 °C operation, the device supports integration into temperature-demanding systems while adhering to RoHS requirements.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation for XCKU085-1FLVA1517I.