XCKU085-1FLVF1924C

The XCKU085-1FLVF1924C is a Kintex® UltraScale™ field programmable gate array (FPGA) IC designed for designs that require very high logic density, substantial on‑chip memory, and extensive I/O. As an UltraScale FPGA device, it integrates a large number of configurable logic resources and embedded RAM in a single surface‑mount FCBGA package.

Its combination of approximately 1,088,325 logic elements, roughly 58.3 Mbits of embedded memory, and 624 I/O pins makes it suitable for complex digital designs that demand dense logic, significant on‑chip storage, and broad connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 1,088,325 logic elements to support large, complex logic implementations and extensive custom digital functions.
• Embedded Memory  Approximately 58.3 Mbits of on‑chip RAM for buffering, lookup tables, and memory‑intensive algorithms.
• I/O Density  624 I/O pins to accommodate high-channel-count interfaces and parallel data paths.
• Power Supply Range  Core voltage supply specified from 922 mV to 979 mV to match target power-rail designs.
• Package and Mounting  1924‑FBGA (1924‑BBGA / 1924‑FCBGA, 45×45) surface‑mount package for high‑density board integration.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Status  RoHS compliant.

Typical Applications

• High‑density digital designs  Implement large-scale custom logic and state machines using the device’s extensive logic element count.
• Memory‑intensive algorithms  On‑chip RAM capacity supports buffering, lookup tables, and algorithm acceleration without immediate external memory reliance.
• High‑channel I/O systems  624 I/Os enable integration of numerous parallel interfaces, sensors, or data lanes.

Unique Advantages

• High logic integration: The large number of logic elements enables consolidation of multiple functions into a single FPGA, reducing board‑level component count.
• Significant on‑chip memory: Approximately 58.3 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage needs.
• Extensive connectivity: 624 I/Os provide flexibility for multi‑lane interfaces and complex peripheral integration.
• Compact FCBGA package: 1924‑pin FCBGA (45×45) allows high resource density in a surface‑mount footprint suitable for space‑constrained designs.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for general commercial deployments.

Why Choose XCKU085-1FLVF1924C?

The XCKU085-1FLVF1924C positions itself as a high‑capacity, commercial‑grade UltraScale FPGA that brings together substantial logic resources, large embedded memory, and a high I/O count in a single 1924‑pin surface‑mount package. It is well suited for engineers needing to implement complex digital systems with significant on‑chip storage and numerous interface channels.

Choose this device when your design requires consolidation of functions into a single FPGA, reduced external memory dependency, and a compact, high‑pin‑count package that fits within a commercial temperature envelope.

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