XCKU085-2FLVA1517I

The XCKU085-2FLVA1517I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD offered in a 1517-ball FCBGA package. It provides very high logic density and substantial on-chip RAM to support complex, resource-intensive FPGA designs.

Key on-chip resources include approximately 1,088,325 logic elements and about 58.3 Mbits of embedded memory, together with 624 user I/O pins. The device is specified for industrial-grade use with a supply range of 922 mV to 979 mV and an operating temperature range of –40 °C to 100 °C.

Key Features

• Core density  Approximately 1,088,325 logic elements, providing high implementation capacity for large, parallel logic designs.
• Embedded memory  Approximately 58.3 Mbits of on-chip RAM for buffering, lookup tables, and storage close to logic.
• Programmable I/O  624 I/O pins to support broad external interface requirements and board-level connectivity.
• Power supply range  Specified supply voltage from 922 mV to 979 mV for core power planning and system integration.
• Industrial temperature and grade  Industrial-grade device rated for –40 °C to 100 °C operation.
• Package & mounting  1517-ball FCBGA package (supplier package: 1517-FCBGA (40×40)), surface-mount configuration for dense PCB integration.

Unique Advantages

• High logic capacity: The large logic element count supports dense designs and complex finite-state machines or datapaths.
• Substantial on-chip memory: Approximately 58.3 Mbits of embedded RAM reduces external memory dependence and shortens data paths.
• Extensive I/O availability: 624 user I/Os enable flexible interfacing to peripherals and multiple board-level signals.
• Industrial robustness: Rated for operation from –40 °C to 100 °C, suitable for demanding thermal environments.
• Compact surface-mount package: 1517-FCBGA (40×40) packaging supports high-density board layouts while maintaining a predictable footprint.

Why Choose XCKU085-2FLVA1517I?

The XCKU085-2FLVA1517I combines a high logic element count and significant embedded memory with a large complement of I/Os to address designs that require substantial on-chip resources in an industrial-grade FPGA package. Its specified voltage and temperature ranges allow straightforward integration into systems with defined power domains and environmental requirements.

Manufactured by AMD and offered in a 1517-FCBGA surface-mount package, this device is suited to projects that need scalable logic capacity and ample on-chip RAM while maintaining rugged operation across a wide temperature range.

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