XCKU060-2FFVA1156E

IC FPGA 520 I/O 1156FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 520 38912000 725550 1156-BBGA, FCBGA

Quantity 752 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O520Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs41460Number of Logic Elements/Cells725550
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits38912000

Overview of XCKU060-2FFVA1156E – Kintex® UltraScale™ Field Programmable Gate Array, 725,550 logic elements, 520 I/O, 1156-FCBGA

The XCKU060-2FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers 725,550 logic elements and approximately 39 Mbits of embedded memory, packaged in a 1156-FCBGA (35x35) surface-mount form factor.

Designed for applications that require a high density of programmable logic and extensive I/O, this device offers a broad supply voltage window and an extended operating temperature range for reliable operation in a range of environments.

Key Features

  • Core Logic Capacity  Provides 725,550 logic elements for large-scale programmable logic implementations.
  • Embedded Memory  Approximately 39 Mbits of on-chip RAM (38,912,000 bits) to support buffering, high-throughput data paths, and local storage.
  • I/O Density  520 user I/O pins to support complex interfacing and multiple parallel interfaces.
  • Power Supply Range  Operates with a supply voltage range of 922 mV to 979 mV, supporting designs with defined core-voltage requirements.
  • Package and Mounting  1156-FCBGA (35x35) package case, surface-mount mounting type, suitable for compact board layouts.
  • Operating Range and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
  • RoHS Compliance  RoHS status: Compliant for environmentally conscious design requirements.

Unique Advantages

  • High logic density: 725,550 logic elements provide substantial programmable resources for complex designs and algorithm implementation.
  • Significant on-chip memory: Approximately 39 Mbits of embedded RAM reduces dependence on external memory for many data-buffering and processing tasks.
  • Extensive I/O count: 520 I/O pins enable wide parallel data paths and flexible connectivity to peripherals and subsystems.
  • Compact FCBGA package: 1156-FCBGA (35x35) packaging balances high integration with a footprint suitable for dense PCB layouts.
  • Extended operating range: Extended-grade device rated 0 °C to 100 °C to accommodate a variety of application environments.
  • Regulatory alignment: RoHS compliant to meet common environmental restrictions.

Why Choose XCKU060-2FFVA1156E?

The XCKU060-2FFVA1156E combines a large pool of logic elements, substantial embedded RAM, and a high I/O count in a compact 1156-FCBGA package. These characteristics make it well suited to designs that require significant on-chip programmable resources and flexible interfacing while maintaining a compact board footprint.

With an extended operating temperature range, a defined core voltage window, and RoHS compliance, this FPGA offers a clear, specification-driven option for teams seeking high-density programmable logic integrated into their systems.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCKU060-2FFVA1156E.

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