XCKU060-2FFVA1156E
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 520 38912000 725550 1156-BBGA, FCBGA |
|---|---|
| Quantity | 752 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 520 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 41460 | Number of Logic Elements/Cells | 725550 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 38912000 |
Overview of XCKU060-2FFVA1156E – Kintex® UltraScale™ Field Programmable Gate Array, 725,550 logic elements, 520 I/O, 1156-FCBGA
The XCKU060-2FFVA1156E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers 725,550 logic elements and approximately 39 Mbits of embedded memory, packaged in a 1156-FCBGA (35x35) surface-mount form factor.
Designed for applications that require a high density of programmable logic and extensive I/O, this device offers a broad supply voltage window and an extended operating temperature range for reliable operation in a range of environments.
Key Features
- Core Logic Capacity Provides 725,550 logic elements for large-scale programmable logic implementations.
- Embedded Memory Approximately 39 Mbits of on-chip RAM (38,912,000 bits) to support buffering, high-throughput data paths, and local storage.
- I/O Density 520 user I/O pins to support complex interfacing and multiple parallel interfaces.
- Power Supply Range Operates with a supply voltage range of 922 mV to 979 mV, supporting designs with defined core-voltage requirements.
- Package and Mounting 1156-FCBGA (35x35) package case, surface-mount mounting type, suitable for compact board layouts.
- Operating Range and Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C.
- RoHS Compliance RoHS status: Compliant for environmentally conscious design requirements.
Unique Advantages
- High logic density: 725,550 logic elements provide substantial programmable resources for complex designs and algorithm implementation.
- Significant on-chip memory: Approximately 39 Mbits of embedded RAM reduces dependence on external memory for many data-buffering and processing tasks.
- Extensive I/O count: 520 I/O pins enable wide parallel data paths and flexible connectivity to peripherals and subsystems.
- Compact FCBGA package: 1156-FCBGA (35x35) packaging balances high integration with a footprint suitable for dense PCB layouts.
- Extended operating range: Extended-grade device rated 0 °C to 100 °C to accommodate a variety of application environments.
- Regulatory alignment: RoHS compliant to meet common environmental restrictions.
Why Choose XCKU060-2FFVA1156E?
The XCKU060-2FFVA1156E combines a large pool of logic elements, substantial embedded RAM, and a high I/O count in a compact 1156-FCBGA package. These characteristics make it well suited to designs that require significant on-chip programmable resources and flexible interfacing while maintaining a compact board footprint.
With an extended operating temperature range, a defined core voltage window, and RoHS compliance, this FPGA offers a clear, specification-driven option for teams seeking high-density programmable logic integrated into their systems.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCKU060-2FFVA1156E.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








