XCKU060-1FFVA1156I

IC FPGA 520 I/O 1156FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 520 38912000 725550 1156-BBGA, FCBGA

Quantity 443 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O520Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs41460Number of Logic Elements/Cells725550
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits38912000

Overview of XCKU060-1FFVA1156I – Kintex® UltraScale™ FPGA, 520 I/O, 1156-FCBGA

The XCKU060-1FFVA1156I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD in a 1156-ball FCBGA package. It delivers a high density of programmable logic and on-chip memory with a large I/O complement, targeting industrial applications that require significant logic capacity and flexible I/O integration.

Key Features

  • Core Logic  725,550 logic elements provide substantial programmable logic capacity for complex custom hardware acceleration and control functions.
  • Embedded Memory  Approximately 39 Mbits of on-chip RAM support large buffering, lookup tables and state storage without external memory.
  • I/O Capability  520 I/O pins enable extensive peripheral and interface connectivity for multi-channel systems and dense board-level integration.
  • Power  Core supply range of 0.922 V to 0.979 V for the device core power domain as specified.
  • Package & Mounting  1156-ball FCBGA (35 × 35 mm) surface-mount package for compact, board-level deployment and high pin-count routing.
  • Operating Temperature & Grade  Rated for industrial operation from −40 °C to 100 °C and specified as industrial grade.
  • Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 725,550 logic elements allow consolidation of complex functions into a single FPGA, reducing system component count.
  • Significant on‑chip memory: Approximately 39 Mbits of embedded RAM supports large buffers and state machines without immediate dependence on external memory.
  • Extensive I/O: 520 I/O pins provide flexibility for multi-protocol interfaces and high-channel-count designs.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
  • Compact high‑pin package: 1156‑FCBGA (35 × 35 mm) enables dense routing and high pin-count connectivity in a manageable footprint.
  • RoHS compliant: Aligns with common environmental requirements for electronics manufacturing.

Why Choose XCKU060-1FFVA1156I?

The XCKU060-1FFVA1156I combines a large logic element count, substantial embedded memory and a high I/O count in a compact 1156-ball FCBGA package, offering a balanced platform for designs that require on‑chip capacity and extensive connectivity. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle and environmentally conscious projects.

This device is well suited for engineers and procurement teams looking for a high‑capacity, industrial‑grade FPGA to consolidate functions, reduce BOM complexity, and provide a scalable foundation for advanced digital designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU060-1FFVA1156I and to discuss how this FPGA can fit your design requirements.

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