XCKU040-L1FBVA676I

The XCKU040-L1FBVA676I is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD, supplied in a 676-ball FCBGA package. It is an industrial-grade device that combines a large logic fabric, significant on-chip memory, and a substantial I/O count for demanding embedded and control-oriented designs.

Key differentiators visible in the datasheet entry include 530,250 logic elements, approximately 21.6 Mbits of embedded memory, and 312 I/Os, all delivered in a compact 676-FCBGA (27×27) surface-mount package with an operating range from −40 °C to 100 °C.

Key Features

• Core Logic Contains 530,250 logic elements, providing a large programmable fabric for implementing complex digital functions and custom logic.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM, enabling local buffering, state storage, and data-path acceleration without external memory for many use cases.
• I/O Capacity 312 I/Os to support wide peripheral connectivity, parallel interfaces, and multi-channel signal routing directly at the FPGA boundary.
• Package & Mounting 676-BBGA, FCBGA package with supplier device package 676-FCBGA (27×27); designed for surface-mount assembly to fit dense PCB layouts.
• Power Specified operating supply range from 880 mV to 979 mV, enabling designers to plan supply rails and power sequencing around the device requirements.
• Temperature & Grade Industrial-grade operation with an ambient range of −40 °C to 100 °C, suitable for extended-temperature deployments.
• Regulatory Compliance RoHS compliant, supporting lead-free manufacturing and environmental compliance goals.

Typical Applications

• Industrial control and automation The industrial-grade temperature range and substantial I/O count make this FPGA suitable for control-system logic, I/O aggregation, and deterministic processing in industrial environments.
• High-density digital processing With 530,250 logic elements and ~21.6 Mbits of embedded memory, the device supports complex data-path implementations and custom acceleration blocks.
• Embedded system integration The combination of on-chip RAM, large logic capacity, and numerous I/Os enables system designers to consolidate functions and reduce external component count in embedded platforms.

Unique Advantages

• Large programmable fabric: 530,250 logic elements provide room for extensive custom logic, allowing complex algorithms and parallel processing structures to be implemented on-chip.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduce reliance on external memory for many buffering and working-set requirements.
• Extensive I/O connectivity: 312 I/Os support broad peripheral interfacing and multiple parallel lanes, simplifying board-level routing for multi-channel designs.
• Compact, industry-ready package: 676-FCBGA (27×27) surface-mount package provides a dense solution for space-constrained PCBs while maintaining high pin count.
• Industrial operating range: Rated from −40 °C to 100 °C for deployments that require extended temperature resilience.
• RoHS compliant: Meets lead-free manufacturing and environmental compliance requirements for modern production processes.

Why Choose XCKU040-L1FBVA676I?

The XCKU040-L1FBVA676I positions itself as an industrial-grade Kintex® UltraScale™ FPGA that combines a large logic element count, substantial embedded memory, and a high peripheral I/O count in a compact 676-FCBGA package. These attributes make it appropriate for designs that need significant on-chip resources and broad connectivity while operating across an extended temperature range.

Manufactured by AMD and offered in a surface-mount FCBGA, this device is suitable for engineering teams and procurement groups targeting industrial applications that require dense programmable logic, local memory capacity, and a high-pin-count package for system consolidation.

Request a quote or submit a procurement inquiry to begin evaluation and obtain pricing and availability for the XCKU040-L1FBVA676I.