XCKU040-3SFVA784E

The XCKU040-3SFVA784E is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD, supplied in a 784‑BFBGA FCCSP package. It combines high logic capacity, substantial embedded memory, and a broad I/O complement for designs that require programmable logic resources and flexible interfacing.

With approximately 530,250 logic elements, roughly 21.6 Mbits of on-chip RAM, and 468 user I/Os, this device targets advanced digital designs that need high integration density, precise power rails, and an extended operating grade.

Key Features

• Core Logic  Approximately 530,250 logic elements provide dense programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Density  468 user I/Os to accommodate wide parallel interfaces, multiple channels, or high-pin-count connectivity requirements.
• Power Supply  Core voltage supply range of 0.97 V to 1.03 V, enabling stable operation within specified supply margins.
• Package and Mounting  784‑BFBGA, FCCSP package (supplier designation 784‑FCCSPBGA, 23×23) in a surface-mount form factor for board-level integration.
• Temperature and Grade  Extended grade device rated for 0 °C to 100 °C operating temperature range, suitable for applications requiring that thermal envelope.
• Environmental Compliance  RoHS‑compliant construction for regulatory alignment in supported markets.

Typical Applications

• High‑density logic systems  Implements complex programmable logic functions where a large number of logic elements are required.
• Memory‑centric designs  Uses the on-chip RAM to provide local buffering and data storage for streaming or block processing tasks.
• Multi‑channel I/O platforms  Supports wide parallel interfaces, sensor arrays, or multi‑lane data acquisition thanks to 468 user I/Os.

Unique Advantages

• High logic capacity: Approximately 530,250 logic elements enable integration of substantial digital functionality on a single device, reducing external component count.
• Significant embedded memory: Around 21.6 Mbits of on-chip RAM helps keep latency low and simplifies board-level memory architecture.
• Large I/O complement: 468 user I/Os give designers flexibility to implement complex interfaces without additional interface chips.
• Compact surface‑mount package: The 784‑BFBGA (784‑FCCSPBGA, 23×23) package offers a high pin-count footprint in a compact form factor for dense PCBs.
• Extended operating grade: Rated 0 °C to 100 °C, aligning the device with applications that operate within that thermal window.
• RoHS compliant: Environmentally compliant manufacturing supports regulatory needs in many markets.

Why Choose XCKU040-3SFVA784E?

The XCKU040-3SFVA784E positions itself as a high‑capacity, highly integrated FPGA option within the Kintex® UltraScale™ family, offering a balance of logic density, embedded memory, and extensive I/O in a compact FCCSP BGA package. Its defined core voltage range and extended operating grade make it suitable for designs that require consistent on-chip performance and predictable thermal behavior.

This device suits design teams and procurement professionals building systems that need substantial programmable logic and memory resources on a single IC, while keeping board-level integration streamlined. Combined with AMD’s documentation and support for the UltraScale family, the part offers a scalable option for complex digital designs.

Request a quote or submit an inquiry to get pricing and availability for the XCKU040-3SFVA784E. Our team can provide lead‑time information and support for your procurement requirements.