XCKU040-L1FFVA1156I

The XCKU040-L1FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD, offered in a 1156-FCBGA (35×35) package for surface-mount applications. It delivers high logic capacity and embedded memory in an industrial-grade device engineered for designs that require dense logic, substantial on-chip RAM, and extensive I/O.

With approximately 530,250 logic elements, about 21.6 Mbits of embedded memory and 520 I/O pins, this FPGA targets applications that demand integration of complex digital functions while operating across an industrial temperature range.

Key Features

• Logic Capacity  530,250 logic elements implemented across 30,300 CLBs to support large, complex logic designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for data buffering, local storage, and algorithm acceleration.
• I/O Count  520 general-purpose I/O pins to interface with multiple peripherals, buses and high-pin-count systems.
• Power Supply  Operates from 880 mV to 979 mV, enabling integration into low-voltage power domains.
• Package & Mounting  1156-FCBGA (35×35) / 1156-BBGA package designed for surface-mount assembly in compact system layouts.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density digital processing  Implement complex logic kernels and custom datapaths using the device’s large logic element count and CLB resources.
• Embedded memory-intensive functions  Leverage approximately 21.6 Mbits of on-chip RAM for buffering, lookup tables and local storage in time-critical systems.
• Multi-interface systems  Use the 520 I/O pins to connect multiple peripherals, sensors, or high-pin-count modules in a single FPGA solution.
• Industrial control and automation  Deploy in factory or process-control equipment that requires an industrial temperature rating and robust surface-mount packaging.

Unique Advantages

• High logic density: 530,250 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM supports data-intensive operations without relying solely on external memory.
• Extensive I/O resources: 520 I/O pins enable broad interfacing options, minimizing the need for external IO expanders.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C to meet the needs of many industrial deployment scenarios.
• Compact, surface-mount package: 1156-FCBGA (35×35) package provides a high-pin-count solution in a compact footprint for modern PCB designs.
• RoHS compliant: Meets environmental restrictions on hazardous substances for regulated product designs.

Why Choose XCKU040-L1FFVA1156I?

The XCKU040-L1FFVA1156I positions itself as a high-capacity, industrial-grade FPGA option suited for engineering teams that need to implement large-scale logic, ample on-chip RAM, and wide I/O connectivity within a compact surface-mount package. Its combination of approximately 530,250 logic elements, roughly 21.6 Mbits of embedded memory, and 520 I/O pins supports consolidation of complex functions onto a single device.

This part is appropriate for projects where scalability, integration and operation across industrial temperature ranges matter. Its packaging and voltage range allow integration into low-voltage, space-constrained systems while maintaining the resources necessary for demanding digital designs.

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