XCKU040-3FBVA900E

The XCKU040-3FBVA900E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 900‑ball FCBGA package. It combines a high count of programmable logic resources, substantial on‑chip memory, and a large number of user I/O to support complex digital designs.

This device is targeted at designs that require significant logic capacity, embedded RAM, and extensive I/O connectivity while operating within an extended temperature range and a low core voltage supply window.

Key Features

• Logic Capacity — Provides 530,250 logic elements to implement large-scale digital logic, custom datapaths, and complex control functions.
• Embedded Memory — Approximately 21.6 Mbits of on‑chip RAM for buffering, FIFOs, and on‑device data storage.
• User I/O — 468 user I/O pins to interface with peripherals, high‑speed transceivers, and board‑level signals.
• Power and Core Voltage — Operates with a core voltage supply range of 0.970 V to 1.03 V to match system power-rail requirements.
• Package and Mounting — 900‑ball FCBGA (900‑FCBGA, 31 × 31 mm) surface‑mount package for dense board integration.
• Operating Temperature and Grade — Extended grade with an operating range of 0 °C to 100 °C for designs requiring wider ambient limits than commercial grade.
• RoHS Compliance — Device is RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• Data Processing and Acceleration — Implement large custom processing pipelines and on‑chip buffering using the device's 530,250 logic elements and ~21.6 Mbits of embedded memory.
• High‑I/O Control Systems — Use the 468 user I/O pins for dense peripheral interfacing, board control, and multi‑lane connectivity.
• Communications and Protocol Offload — Deploy protocol engines and packet buffering that leverage the combination of logic resources and embedded RAM.
• Complex Control and Automation — Integrate state machines, signal processing blocks, and memory‑backed control logic within a single FPGA package.

Unique Advantages

• Substantial Logic Density: 530,250 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• On‑Chip Memory Resource: Approximately 21.6 Mbits of embedded RAM supports buffering and low‑latency data paths without external memory.
• High I/O Count: 468 user I/Os provide flexibility for complex interfaces and parallel connections, simplifying board routing strategies.
• Compact, High‑Density Package: 900‑ball FCBGA (31 × 31 mm) offers a small footprint for high‑capacity FPGA integration on space‑constrained PCBs.
• Extended Operating Range: 0 °C to 100 °C grade accommodates applications that require wider ambient conditions than standard commercial parts.
• RoHS Compliant: Meets lead‑free manufacturing requirements for modern assembly processes.

Why Choose XCKU040-3FBVA900E?

The XCKU040-3FBVA900E delivers a balanced combination of large logic capacity, meaningful embedded memory, and extensive I/O in a compact 900‑ball FCBGA package. Its extended temperature grade and narrow core voltage range make it suitable for systems that require a reliable, high‑density programmable platform.

This FPGA is well suited for engineering teams building complex digital systems that benefit from on‑device RAM and a high count of logic elements—providing scalability for evolving designs while consolidating multiple functions into a single component.

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