XCKU040-2FFVA1156I

The XCKU040-2FFVA1156I is a Kintex® UltraScale™ field-programmable gate array (FPGA) IC from AMD. It delivers a high-density programmable fabric with 530,250 logic elements and approximately 21.6 Mbits of embedded memory for complex logic and buffering needs.

Engineered for industrial-grade applications, this device provides 520 user I/O, a 922 mV to 979 mV supply range, and an operating temperature span of −40 °C to 100 °C in a 1156-ball FCBGA (35×35) surface-mount package.

Key Features

• Core  Kintex® UltraScale™ FPGA fabric with 530,250 logic elements to implement complex, high-density logic designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM (21,606,000 bits total) for buffering, state storage and local data handling.
• I/O Capacity  520 user I/O pins to support a wide range of external interfaces and connectivity requirements.
• Power  Designed to operate within a supply voltage range of 922 mV to 979 mV.
• Package & Mounting  1156-FCBGA (35×35) package, surface-mount (1156-BBGA, FCBGA) for compact board-level integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Consolidating control logic and multiple I/O interfaces in systems that require industrial temperature operation.
• Embedded Processing Platforms  Implementing large custom logic blocks and on-chip memory for application-specific processing tasks.
• Prototyping and Custom Logic Development  Building and validating complex digital designs that demand high logic density and sizable embedded RAM.
• High-density I/O Systems  Aggregating or bridging many external signals where a large user I/O count is required.

Unique Advantages

• High logic density: 530,250 logic elements enable implementation of large, complex designs without immediate need for additional FPGA resources.
• Substantial on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage tasks.
• Generous I/O count: 520 user I/O pins support multiple peripheral interfaces and high channel counts on a single device.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact package integration: 1156-FCBGA (35×35) surface-mount package balances high pin count with board-level space considerations.
• RoHS compliant: Meets common environmental regulatory requirements for lead-free assembly.

Why Choose XCKU040-2FFVA1156I?

The XCKU040-2FFVA1156I combines high logic element count, substantial embedded memory and a large I/O complement in an industrial-temperature, compact FCBGA package. As a member of the Kintex® UltraScale™ family from AMD, it offers designers a platform suited to dense, memory-hungry logic implementations where reliability across a wide temperature range and a high pin count are required.

This device is well suited to teams and projects that need scalable logic capacity, extensive on-chip RAM, and robust I/O in industrial applications—delivering a balance of integration and deployment-ready characteristics for long-term designs.

Request a quote or submit an inquiry today to get pricing and availability details for the XCKU040-2FFVA1156I.