XCKU040-2FBVA900E

The XCKU040-2FBVA900E is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD in a 900-ball FCBGA package. It delivers high logic capacity, substantial on-chip memory, and a large I/O count for designs that require dense integration and programmable hardware resources.

This device targets applications that need substantial logic and embedded memory resources in a surface-mount FCBGA package, and is offered in an extended-grade temperature range with RoHS compliance.

Key Features

• Core Logic 30,300 configurable logic blocks (CLBs) supporting 530,250 logic elements to implement complex digital designs and custom compute pipelines.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage to support memory-intensive functions.
• High-Density I/O 468 user I/O pins for broad peripheral connectivity and board-level interfacing.
• Power Specified supply range from 922 mV to 979 mV to match system power-rail planning and regulator selection requirements.
• Package & Mounting 900-FCBGA (31×31 mm) package in a surface-mount form factor for compact, high-pin-count board designs.
• Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for applications within this thermal envelope.
• Compliance RoHS compliant to meet environmental and lead-free requirements.

Typical Applications

• High-density digital processing — Implements custom logic and parallel processing functions using 530,250 logic elements and extensive CLB resources.
• Memory-backed data handling — Leverages approximately 21.6 Mbits of embedded RAM for buffering, packet processing, and temporary storage.
• High-pin-count interfaces — Uses 468 I/Os to connect to multiple peripherals, serializers/deserializers, or board-level interfaces.
• Compact system integration — 900-ball FCBGA surface-mount package enables high integration density on space-constrained PCBs.

Unique Advantages

• Large logic fabric: 530,250 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators on a single device.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces the need for external memory in many buffering and local-storage use cases.
• Broad connectivity: 468 user I/Os allow flexible interfacing to a wide range of digital peripherals and board-level signals.
• Compact, high-pin package: 900-FCBGA (31×31) delivers high pin count in a compact footprint for dense PCB designs.
• Designed for extended environments: Extended grade rating and a 0 °C to 100 °C operating range align with many commercial and industrial-adjacent applications that operate within this range.
• Regulatory-friendly material compliance: RoHS compliance supports lead-free assembly and environmental requirements.

Why Choose XCKU040-2FBVA900E?

The XCKU040-2FBVA900E offers a combination of substantial logic capacity, meaningful embedded memory, and a high I/O count in a single surface-mount FCBGA package. This configuration is well suited to engineers needing a programmable platform that consolidates logic, memory, and connectivity into a compact footprint while maintaining RoHS compliance and extended-grade thermal operation.

Choose this Kintex® UltraScale™ FPGA when your design calls for scalable logic resources, on-chip memory to minimize external components, and a high number of I/Os for dense system integration.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XCKU040-2FBVA900E.