XCKU040-1SFVA784C

The XCKU040-1SFVA784C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, provided in a 784-BFBGA / FCCSP package. It delivers a combination of large logic capacity, substantial on-chip memory, and high I/O density in a commercial-grade, surface-mount FPGA.

This device is appropriate for designs that require significant programmable logic resources and embedded memory while fitting a compact 23×23 package footprint and operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 530,250 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 21.6 Mbits of on-chip RAM for data buffering, FIFOs, and local storage for algorithms.
• I/O Resources — 468 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 784-BFBGA, supplied as 784-FCCSPBGA (23×23) in a surface-mount format to minimize board area.
• Power Supply — Core supply range of 922 mV to 979 mV to match low-voltage power rails.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0°C to 85°C.
• Regulatory Compliance — RoHS compliant for lead-free assembly and regulatory adherence.

Typical Applications

• High-density I/O systems — Leverage 468 I/O pins for multi-channel interfaces, parallel buses, or complex peripheral aggregation.
• Memory-intensive logic — Use approximately 21.6 Mbits of embedded RAM for buffering, packet memory, and local data storage in FPGA-based designs.
• Compute-heavy programmable logic — Deploy 530,250 logic elements for substantial custom processing, state machines, and control logic implementations.

Unique Advantages

• High logic density: 530,250 logic elements allow implementation of large, complex designs without external logic devices.
• Significant on-chip memory: Approximately 21.6 Mbits of RAM reduces dependence on external memory for many applications.
• Extensive I/O: 468 I/O pins provide flexibility for interfacing to multiple subsystems and high-channel-count applications.
• Compact, surface-mount package: 784-FCCSPBGA (23×23) package minimizes PCB footprint while supporting high-density routing.
• Commercial temperature rating: Operates from 0°C to 85°C for standard commercial environments.
• RoHS compliant: Supports lead-free manufacturing and regulatory compliance.

Why Choose XCKU040-1SFVA784C?

The XCKU040-1SFVA784C combines the Kintex® UltraScale™ FPGA architecture with a high logic element count, substantial embedded RAM, and broad I/O capability in a compact 784-BFBGA surface-mount package. Its commercial-grade operating range and defined core supply window make it suitable for mainstream embedded and digital designs that need programmable logic density and on-chip memory.

This device is well suited to engineering teams and product designs that require scalable programmable resources, reduced board-level component count, and a compact package footprint while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU040-1SFVA784C and support for your design requirements.