XCKU040-1FBVA900I

IC FPGA 468 I/O 900FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 468 21606000 530250 900-BBGA, FCBGA

Quantity 32 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package900-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O468Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs30300Number of Logic Elements/Cells530250
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits21606000

Overview of XCKU040-1FBVA900I – Kintex® UltraScale™ FPGA, 900-FCBGA

The XCKU040-1FBVA900I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 900-FCBGA surface-mount package. It delivers a high logic capacity with 530,250 logic elements, approximately 21.6 Mbits of embedded memory, and 468 I/O to support dense programmable logic implementations.

Manufactured for industrial use, the device operates from -40°C to 100°C, accepts a supply range of 922 mV to 979 mV, and is RoHS compliant. The 900-FCBGA (31×31) package facilitates compact board integration while meeting industrial temperature requirements.

Key Features

  • Core Logic Density 530,250 logic elements provide substantial programmable logic capacity for demanding implementations.
  • Embedded Memory Approximately 21.6 Mbits of on-chip RAM for data buffering, lookup tables, and intermediate storage.
  • I/O Resources 468 I/O pins enable extensive parallel interfacing and system-level connectivity.
  • Package & Mounting 900-FCBGA (31×31) surface-mount package designed for compact, high-density board layouts.
  • Power Supply Specified operating supply range from 922 mV to 979 mV to guide power delivery design.
  • Temperature & Grade Industrial-grade operation from -40°C to 100°C for extended-temperature deployments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 530,250 logic elements enable large-scale programmable designs without immediate need for external logic expansion.
  • Significant embedded memory: Approximately 21.6 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
  • Extensive I/O count: 468 I/O pins support multiple parallel interfaces and complex system interconnects.
  • Industrial temperature range: Rated from -40°C to 100°C for reliable operation in extended-temperature environments.
  • Dense, compact package: 900-FCBGA (31×31) surface-mount form factor optimizes PCB real estate for space-constrained systems.
  • Regulatory compliance: RoHS compliance supports environmentally conscious designs.

Why Choose XCKU040-1FBVA900I?

The XCKU040-1FBVA900I combines substantial programmable logic resources, embedded memory, and a high I/O count in a compact 900-FCBGA package, positioned for designs that require dense FPGA capacity with industrial temperature tolerance. Its specified supply range and RoHS compliance help align system-level power and environmental planning with project requirements.

This device is suited for engineering teams and procurement looking for an industrial-grade Kintex® UltraScale™ FPGA with clear on-chip resource figures—logic elements, embedded memory, and I/O—that support scalable, high-density implementations.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU040-1FBVA900I.

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