XCKU040-1FBVA900I
| Part Description |
Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 468 21606000 530250 900-BBGA, FCBGA |
|---|---|
| Quantity | 32 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 468 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 30300 | Number of Logic Elements/Cells | 530250 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21606000 |
Overview of XCKU040-1FBVA900I – Kintex® UltraScale™ FPGA, 900-FCBGA
The XCKU040-1FBVA900I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 900-FCBGA surface-mount package. It delivers a high logic capacity with 530,250 logic elements, approximately 21.6 Mbits of embedded memory, and 468 I/O to support dense programmable logic implementations.
Manufactured for industrial use, the device operates from -40°C to 100°C, accepts a supply range of 922 mV to 979 mV, and is RoHS compliant. The 900-FCBGA (31×31) package facilitates compact board integration while meeting industrial temperature requirements.
Key Features
- Core Logic Density 530,250 logic elements provide substantial programmable logic capacity for demanding implementations.
- Embedded Memory Approximately 21.6 Mbits of on-chip RAM for data buffering, lookup tables, and intermediate storage.
- I/O Resources 468 I/O pins enable extensive parallel interfacing and system-level connectivity.
- Package & Mounting 900-FCBGA (31×31) surface-mount package designed for compact, high-density board layouts.
- Power Supply Specified operating supply range from 922 mV to 979 mV to guide power delivery design.
- Temperature & Grade Industrial-grade operation from -40°C to 100°C for extended-temperature deployments.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 530,250 logic elements enable large-scale programmable designs without immediate need for external logic expansion.
- Significant embedded memory: Approximately 21.6 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
- Extensive I/O count: 468 I/O pins support multiple parallel interfaces and complex system interconnects.
- Industrial temperature range: Rated from -40°C to 100°C for reliable operation in extended-temperature environments.
- Dense, compact package: 900-FCBGA (31×31) surface-mount form factor optimizes PCB real estate for space-constrained systems.
- Regulatory compliance: RoHS compliance supports environmentally conscious designs.
Why Choose XCKU040-1FBVA900I?
The XCKU040-1FBVA900I combines substantial programmable logic resources, embedded memory, and a high I/O count in a compact 900-FCBGA package, positioned for designs that require dense FPGA capacity with industrial temperature tolerance. Its specified supply range and RoHS compliance help align system-level power and environmental planning with project requirements.
This device is suited for engineering teams and procurement looking for an industrial-grade Kintex® UltraScale™ FPGA with clear on-chip resource figures—logic elements, embedded memory, and I/O—that support scalable, high-density implementations.
Request a quote or submit an inquiry to receive pricing and availability information for the XCKU040-1FBVA900I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








