XCKU040-1FBVA676I

The XCKU040-1FBVA676I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) integrated circuit in a 676-ball FCBGA package designed for industrial applications. It integrates a large programmable logic fabric, substantial on-chip memory, and a high pin count in a surface-mount package suitable for designs requiring configurable digital logic at industrial temperature grades.

Key Features

• Core Architecture  Kintex® UltraScale™ FPGA family device providing a programmable logic fabric for custom digital implementations.
• Logic Capacity  530,250 logic elements for implementing complex logic, state machines and custom datapaths.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Count  312 user I/O pins to accommodate a broad set of interfaces and peripheral connections.
• Package & Mounting  676-ball FCBGA (27×27) package in a 676-BBGA footprint, surface-mount mounting for compact board integration.
• Voltage Supply  Core/operating supply specified between 922 mV and 979 mV.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation and Control  Implement custom control logic, motor-control interfaces and sensor aggregation using the device’s programmable logic and 312 I/O pins within an industrial temperature range.
• Data Acquisition and Signal Processing  Leverage approximately 21.6 Mbits of embedded memory and 530,250 logic elements to buffer and process streaming sensor or measurement data on-chip.
• Communications and Networking  Use the high logic capacity and abundant I/O to realize protocol processing, framing, and interface bridging in communication equipment.

Unique Advantages

• High-programmable logic density: 530,250 logic elements allow complex custom designs and large multi-function FPGA implementations.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation to meet thermal demands of industrial deployment.
• Compact, high-pin package: 676-FCBGA (27×27) delivers a high I/O count and dense integration in a surface-mount format for space-constrained PCBs.
• Low-voltage core supply: Core supply range of 922 mV to 979 mV supports designs targeting low-voltage FPGA operation.
• RoHS compliant: Environmentally compliant materials align with common regulatory and manufacturing requirements.

Why Choose XCKU040-1FBVA676I?

The XCKU040-1FBVA676I positions itself as a high-capacity, industrial-grade programmable logic device suitable for engineering teams needing substantial on-chip logic and memory in a compact FCBGA package. Its combination of 530,250 logic elements, approximately 21.6 Mbits of embedded memory and 312 I/O pins supports complex control, processing and interfacing tasks while meeting industrial temperature and RoHS requirements.

This FPGA is suited to designs that require scalable, on-board programmable logic and memory integration—helping reduce external component count and consolidating functions into a single device for streamlined board design and integration.

Request a quote or submit a parts inquiry to get pricing and availability for the XCKU040-1FBVA676I. Our team can provide configuration and procurement assistance tailored to your project needs.