XCKU040-1FFVA1156C

The XCKU040-1FFVA1156C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1156-FCBGA (35×35) package. This commercial-grade FPGA provides high logic capacity, extensive I/O count, and substantial on-chip memory for complex digital designs.

Key device characteristics include 530,250 logic elements, approximately 21.6 Mbits of embedded RAM, 520 I/Os, and an operating voltage range of 922 mV to 979 mV, making it suitable for designs that require significant logic density, bandwidth to external devices, and on-chip storage.

Key Features

• Logic Capacity  Provides 530,250 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for processing pipelines.
• I/O Resources  520 general-purpose I/Os to interface with external devices, peripherals, and high-density connectors.
• Package  1156-BBGA, FCBGA package (1156-FCBGA, 35×35) for surface-mount board designs requiring a compact, high-pin-count footprint.
• Power and Supply  Specified core/operating supply range of 922 mV to 979 mV to match system power-rail design requirements.
• Operating Temperature  Commercial temperature rating of 0 °C to 85 °C for typical commercial applications.
• Mounting and Compliance  Surface-mount device with RoHS compliance for regulatory and manufacturing requirements.

Typical Applications

• Communications Equipment  Use the device where high logic density and numerous I/Os are required for protocol processing and interface aggregation.
• Signal and Image Processing  On-chip RAM and abundant logic elements support data buffering and parallel processing tasks common in video and signal pipelines.
• High‑I/O Control and Bridging  Large I/O count enables integration of multiple external interfaces, sensors, and peripherals in single-board designs.
• Prototyping and Complex Embedded Designs  High logic capacity suits development platforms and systems that require extensive custom logic and resource headroom.

Unique Advantages

• High Logic Density: 530,250 logic elements provide the resources needed to implement large, complex designs without partitioning across multiple devices.
• Significant On‑Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad requirements.
• Extensive I/O Count: 520 I/Os simplify board-level integration by supporting many external interfaces directly on the FPGA.
• Compact High‑Pin Package: The 1156-FCBGA (35×35) footprint delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with standard commercial application environments.
• RoHS Compliant: Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose XCKU040-1FFVA1156C?

The XCKU040-1FFVA1156C positions itself as a commercial-grade Kintex UltraScale FPGA for designs that demand substantial logic resources, large embedded memory, and a high number of I/Os in a compact FCBGA package. Its combination of 530,250 logic elements, approximately 21.6 Mbits of on-chip RAM, and 520 I/Os supports complex digital architectures and dense board-level integration.

This device is well suited to engineering teams developing mid- to high-complexity digital systems that require reliable, scalable FPGA resources while conforming to commercial temperature and RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU040-1FFVA1156C.