XCKU040-1FBVA900C

The XCKU040-1FBVA900C is a Kintex® UltraScale™ field programmable gate array (FPGA) in a 900‑ball FCBGA package designed for high‑density digital designs. It delivers a large logic capacity, significant on‑chip memory, and a high pin count to support complex embedded systems and I/O‑intensive applications.

Engineered for commercial‑grade applications, this device is suited to designs that require substantial logic resources, on‑chip RAM, and broad I/O connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — Provides 530,250 logic elements to implement complex logic functions and custom accelerators.
• Programmable Fabric — Large programmable fabric suitable for partitioning multiple functions within a single device.
• Embedded Memory — Approximately 21.6 Mbits of on‑chip RAM to support buffering, LUT storage, and data processing.
• I/O Density — 468 user I/O pins to facilitate high‑connectivity designs and dense board routing.
• Voltage Supply — Supported core supply range from 922 mV to 979 mV for device power domains.
• Package & Mounting — 900‑ball FCBGA (31 × 31 mm) surface‑mount package for compact, high‑density board integration.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and regulatory compliance.

Typical Applications

• Communications & Networking — Leverages high I/O count and large logic capacity for packet processing, protocol offload, and interface aggregation.
• Signal Processing — Supports algorithms and datapaths that require substantial on‑chip RAM and arithmetic resources.
• High‑Density Embedded Systems — Integrates multiple functions on a single FPGA to reduce system BOM and simplify board layouts.
• Prototyping & Custom Hardware Acceleration — Provides the programmable fabric and memory resources needed for prototyping ASIC functions or implementing hardware accelerators.

Unique Advantages

• Significant Logic Resources: 530,250 logic elements enable large designs and complex state machines without partitioning across multiple devices.
• Ample On‑Chip RAM: Approximately 21.6 Mbits of embedded memory supports buffering, FIFOs, and local data storage for high‑throughput designs.
• High I/O Count: 468 I/O pins allow direct interfacing to multiple peripherals, lanes, and high‑speed interfaces.
• Compact High‑Density Package: 900‑ball FCBGA package offers a dense footprint for space‑constrained PCBs while providing the pin count needed for complex systems.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial deployment environments and system cooling strategies.
• Regulatory Readiness: RoHS compliance simplifies lead‑free assembly and end‑product compliance efforts.

Why Choose XCKU040-1FBVA900C?

The XCKU040-1FBVA900C balances large programmable logic capacity, substantial embedded memory, and high I/O density in a compact 900‑ball FCBGA package. It is positioned for designers who need to consolidate complex digital functions and high‑bandwidth interfaces into a single commercial‑grade FPGA.

This device is well suited to engineering teams developing communications, signal processing, or embedded acceleration solutions that demand scalable logic resources, efficient on‑chip memory, and broad connectivity while maintaining RoHS compliance.

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