XCKU035-L1FBVA676I

The XCKU035-L1FBVA676I is a Kintex® UltraScale™ field programmable gate array (FPGA) from AMD, presented in a 676-ball FCBGA package. It provides a balance of logic capacity, embedded memory, and I/O count for designs that require on-chip programmable logic and moderate embedded RAM.

This device is specified for industrial operation and supports a core voltage supply range of 880 mV to 979 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for deployment in temperature-demanding environments.

Key Features

• Logic Capacity  Approximately 444,343 logic elements to implement complex programmable logic and custom processing functions.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources  312 I/O pins available for external interfaces, sensor connections, and board-level signaling.
• Power Supply  Core voltage specified between 880 mV and 979 mV to match system power rails and regulator selections.
• Package  676-ball BGA (676-FCBGA) package, supplier package dimension 27 × 27 mm for compact board integration.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployment in harsh thermal environments.
• Mounting and Compliance  Surface-mount device with RoHS compliance for standard PCB assembly and environmental requirements.

Unique Advantages

• Substantial logic resources: The device’s ~444k logic elements support integration of sizeable custom logic and multiple functional blocks on a single FPGA.
• Ample on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
• Robust I/O count: 312 I/Os enable dense connectivity to peripherals, sensors, and board-level interfaces without immediate need for external I/O expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet the thermal needs of industrial applications and temperature-variable deployments.
• Compact ball-grid packaging: The 676-FCBGA (27×27 mm) package provides a high pin-count solution in a space-efficient footprint for compact system designs.
• Low-voltage core operation: Core voltage range of 880–979 mV enables integration with low-voltage power architectures commonly used in modern FPGA systems.

Why Choose XCKU035-L1FBVA676I?

The XCKU035-L1FBVA676I combines significant programmable logic capacity, substantial embedded RAM, and a high I/O count in a compact 676-FCBGA package, offering a practical solution for designs that require on-chip integration of complex logic and memory. Its industrial temperature rating and defined core voltage range make it appropriate for temperature-challenging and low-voltage system environments.

This FPGA is suited to teams and projects that need a balance of logic density, on-chip memory, and board-level connectivity while maintaining compact package dimensions and industrial-grade temperature tolerance.

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