XCKU035-3FFVA1156E

The XCKU035-3FFVA1156E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC delivering substantial on-chip logic and memory resources in a 1156-ball FCBGA package. It combines a large logic element count with a wide I/O complement and an extended operating grade for demanding board-level designs.

Key hardware characteristics include 444,343 logic elements, approximately 19.46 Mbits of embedded memory, 520 I/O pins, a 970 mV to 1.03 V core supply range, and an operating temperature range of 0 °C to 100 °C. The device is supplied in a 1156-FCBGA (35×35) surface-mount package and is RoHS compliant.

Key Features

• Core Architecture Kintex® UltraScale™ FPGA fabric implemented in the XCKU035-3FFVA1156E, providing a large programmable logic resource set.
• Logic Capacity 444,343 logic elements and 25,391 CLBs for complex digital logic and custom processing implementations.
• Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support buffering, caching, and intermediate data storage.
• I/O Resources 520 available I/O pins to support diverse board-level interfaces and parallel connectivity.
• Power Supply Core voltage range of 970 mV to 1.03 V for compatibility with targeted power delivery designs.
• Package & Mounting 1156-BBGA / 1156-FCBGA package (supplier device package: 1156-FCBGA (35×35)), surface-mount mounting type for high-density PCB integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for a broad set of environmental conditions.
• Regulatory RoHS compliant.

Unique Advantages

• Significant logic and CLB capacity: 444,343 logic elements and 25,391 CLBs enable large-scale custom logic and parallel processing implementations without external logic expansion.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces dependency on external memory for many buffering and temporary storage needs.
• Broad I/O availability: 520 I/O pins provide flexibility for multi-channel interfaces, wide parallel buses, and diverse peripheral connections.
• Compact, high-pin-count package: The 1156-FCBGA (35×35) surface-mount package balances pin density and PCB real estate for complex board designs.
• Extended operating grade: Rated 0 °C to 100 °C to support applications requiring above-room-temperature operation within this range.
• RoHS compliance: Supports environmentally conscious designs and supply-chain requirements.

Why Choose XCKU035-3FFVA1156E?

The XCKU035-3FFVA1156E positions itself as a high-capacity, flexible FPGA solution for designs that demand large programmable logic resources, substantial embedded memory, and a wide I/O complement in a single-package device. Its extended grade and surface-mount 1156-FCBGA package make it suitable for board-level deployments that prioritize integration density and on-chip capability.

Designers and procurement teams looking for scalable logic and memory resources with clear electrical and thermal operating bounds will find this Kintex® UltraScale™ device appropriate for complex FPGA-based systems. The combination of logic density, embedded RAM, and I/O count delivers long-term value through reduced external component requirements and predictable integration characteristics.

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